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SEMICONDUCTOR CHIP WITH FINE PITCH LEADS FOR NORMAL TESTING OF SAME

  • US 20110309358A1
  • Filed: 12/27/2010
  • Published: 12/22/2011
  • Est. Priority Date: 06/17/2010
  • Status: Abandoned Application
First Claim
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1. A semiconductor chip comprising:

  • a semiconductor substrate having a top surface and a bottom surface;

    a circuit layer formed over the top surface of the semiconductor substrate and having bonding pads;

    through electrodes formed to pass from a bottom surface to the top surface of the semiconductor substrate, and comprising through parts connected with the bonding pads and projecting parts formed on the bottom surface of the semiconductor substrate; and

    test pad parts disposed on the bottom surface of the semiconductor substrate and connected with the through electrodes.

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