NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
First Claim
1. A nonvolatile semiconductor memory device, comprising:
- a first stacked body including a plurality of first electrode films stacked in a first direction and a first inter-electrode insulating film provided between the plurality of first electrode films;
a first conductive pillar piercing the first stacked body in the first direction;
a first pillar inner insulating film provided between the first conductive pillar and the first electrode films, the first pillar inner insulating film being provided around a side face of the first conductive pillar;
a first semiconductor pillar provided between the first pillar inner insulating film and the first electrode films to pierce the first stacked body along the first direction, the first semiconductor pillar being provided around a side face of the first pillar inner insulating film;
a first pillar intermediate insulating film provided between the first semiconductor pillar and the first electrode films, the first pillar intermediate insulating film being provided around a side face of the first semiconductor pillar;
a first pillar memory layer provided between the first pillar intermediate insulating film and the first electrode films, the first pillar memory layer being provided around a side face of the first pillar intermediate insulating film; and
a first pillar outer insulating film provided between the first pillar memory layer and the first electrode films, the first pillar outer insulating film being provided around a side face of the first pillar memory layer.
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Abstract
According to one embodiment, a nonvolatile semiconductor memory device includes a stacked body including electrode films stacked in a first direction; a conductive pillar piercing the stacked body in the first direction; a inner insulating film; a semiconductor pillar; an intermediate insulating film; a memory layer; and an outer insulating film. The inner insulating film, the semiconductor pillar, the intermediate insulating film, the memory layer and the outer insulating film are provided between the conductive pillar and the electrode films. The inner insulating film is provided around a side face of the conductive pillar. The semiconductor pillar is provided around a side face of the inner insulating film. The intermediate insulating film is provided around a side face of the semiconductor pillar. The memory layer is provided around a side face of the intermediate insulating film. The outer insulating film is provided around a side face of the memory layer.
148 Citations
20 Claims
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1. A nonvolatile semiconductor memory device, comprising:
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a first stacked body including a plurality of first electrode films stacked in a first direction and a first inter-electrode insulating film provided between the plurality of first electrode films; a first conductive pillar piercing the first stacked body in the first direction; a first pillar inner insulating film provided between the first conductive pillar and the first electrode films, the first pillar inner insulating film being provided around a side face of the first conductive pillar; a first semiconductor pillar provided between the first pillar inner insulating film and the first electrode films to pierce the first stacked body along the first direction, the first semiconductor pillar being provided around a side face of the first pillar inner insulating film; a first pillar intermediate insulating film provided between the first semiconductor pillar and the first electrode films, the first pillar intermediate insulating film being provided around a side face of the first semiconductor pillar; a first pillar memory layer provided between the first pillar intermediate insulating film and the first electrode films, the first pillar memory layer being provided around a side face of the first pillar intermediate insulating film; and a first pillar outer insulating film provided between the first pillar memory layer and the first electrode films, the first pillar outer insulating film being provided around a side face of the first pillar memory layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method for manufacturing a nonvolatile semiconductor memory device, comprising:
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making a through-hole piercing a stacked body and an inter-layer insulating film along a first direction, the inter-layer insulating film being stacked with the stacked body, the stacked body including a plurality of electrode films stacked in the first direction and an inter-electrode insulating film provided between the plurality of electrode films; depositing a stacked film of a film used to form a pillar outer insulating film, a film used to form a pillar memory layer, a film used to form a pillar intermediate insulating film, a film used to form a semiconductor pillar, a film used to form a pillar inner insulating film, and a film used to form a conductive pillar sequentially on an inner wall of the through-hole; exposing the film used to form the pillar outer insulating film by performing etch-back of at least a portion of the inter-layer insulating film; exposing a side face of the film used to form the semiconductor pillar by removing the exposed film used to form the pillar outer insulating film, the film used to form the pillar memory layer, and the film used to form the pillar intermediate insulating film; and forming a film used to form an interconnect, the film used to form the interconnect being electrically connected to the exposed side face of the film used to form the semiconductor pillar.
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Specification