FINGER SENSOR INCLUDING ENCAPSULATING LAYER OVER SENSING AREA AND RELATED METHODS
First Claim
Patent Images
1. A fingerprint sensor comprising:
- a substrate;
a finger sensing integrated circuit (IC) on said substrate and comprising a finger sensing area on an upper surface thereof for sensing an adjacent finger;
an encapsulating material on said finger sensing IC and covering said finger sensing area; and
a bezel adjacent the finger sensing area and on an uppermost surface of said encapsulating layer.
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Abstract
A fingerprint sensor may include a substrate, and a finger sensing IC on the substrate and including a finger sensing area on an upper surface thereof for sensing an adjacent finger. The fingerprint sensor may include an encapsulating material on the finger sensing IC and covering the finger sensing area, and a bezel adjacent the finger sensing area and on an uppermost surface of the encapsulating layer.
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Citations
22 Claims
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1. A fingerprint sensor comprising:
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a substrate; a finger sensing integrated circuit (IC) on said substrate and comprising a finger sensing area on an upper surface thereof for sensing an adjacent finger; an encapsulating material on said finger sensing IC and covering said finger sensing area; and a bezel adjacent the finger sensing area and on an uppermost surface of said encapsulating layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A fingerprint sensor comprising:
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a substrate; a finger sensing integrated circuit (IC) on said substrate and comprising a finger sensing area on an upper surface thereof for sensing an adjacent finger, said finger sensing area comprising an array of electric field sensing electrodes; an encapsulating material on said finger sensing IC and covering said finger sensing area; a bezel adjacent the finger sensing area and on an uppermost surface of said encapsulating layer; and at least one electrostatic discharge (ESD) circuit coupled to said bezel so that said bezel defines an ESD electrode. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A method of making a fingerprint sensor comprising:
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positioning a finger sensing integrated circuit (IC) on a substrate, the finger sensing IC comprising a finger sensing area on an upper surface thereof for sensing an adjacent finger; forming an encapsulating material on the finger sensing IC and to cover the finger sensing area; and positioning a bezel to be adjacent the finger sensing area and to be on an uppermost surface of the encapsulating layer. - View Dependent Claims (18, 19, 20, 21, 22)
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Specification