SOLID-STATE RF POWER AMPLIFIER FOR RADIO TRANSMITTERS

• US 20110309884A1
• Filed: 09/01/2011
• Published: 12/22/2011
• Est. Priority Date: 05/17/2006
• Status: Active Grant

• Current Assignee: Steven M. Dishop
• Original Assignee: Steven M. Dishop
• Inventors: Dishop, Steven M.
• Granted Patent: US 8,130,039 B2
• Time in Patent Office: Days
• US Class Current: 330/276
• CPC Class Codes: H03F 2200/451 the amplifier being a radio frequency amplifier
• CPC Class Codes: H03F 2200/534 Transformer coupled at the input of an amplifier
• CPC Class Codes: H03F 2200/541 Transformer coupled at the output of an amplifier
• CPC Class Codes: H03F 2203/21103 An impedance adaptation circuit being added at the input of a power amplifier stage
• CPC Class Codes: H03F 2203/21106 An input signal being distributed in parallel over the inputs of a plurality of power amplifiers
• CPC Class Codes: H03F 2203/21139 An impedance adaptation circuit being added at the output of a power amplifier stage
• CPC Class Codes: H03F 2203/21142 Output signals of a plurality of power amplifiers are parallel combined to a common output
• CPC Class Codes: H03F 3/211 using a combination of several amplifiers H03F3/60 takes precedence
• CPC Class Codes: H03F 3/24 of transmitter output stages
• CPC Class Codes: H03F 3/265 with field-effect transistors only
• CPC Class Codes: H03F 3/3098 using a transformer as phase splitter

Abstract

An RF power amplifier includes a first amplifier module comprising a first push-pull amplifier including a first plurality of field effect transistors and a first output transformer. An output impedance of the first amplifier module is 25 ohms. A second amplifier module includes a second push-pull amplifier including a second plurality of field effect transistors and a second output transformer. An output impedance of the second amplifier module is 25 ohms. A combiner is connected to the first amplifier module and the second amplifier module. The combiner combines an output from the first amplifier module and an output from the second amplifier module into a combined signal. An output impedance of the combiner is 50 ohms.

Claims

1. An RF power amplifier, comprising:

a first amplifier module comprising a first push-pull amplifier including a first plurality of field effect transistors and a first output transformer, wherein an output impedance of the first amplifier module is 25 ohms;

a second amplifier module comprising a second push-pull amplifier including a second plurality of field effect transistors and a second output transformer, wherein an output impedance of the second amplifier module is 25 ohms; and

a combiner connected to the first amplifier module and the second amplifier module, wherein the combiner combines an output from the first amplifier module and an output from the second amplifier module into a combined signal, and wherein an output impedance of the combiner is 50 ohms.

2. The RF power amplifier of claim 1, wherein the combiner includes a 0°

hybrid combiner and an unbalanced-to-unbalanced output transformer having an input-to-output impedance ratio of 1;

4, and wherein the combined signal is supplied to the unbalanced-to-unbalanced output transformer.

3. The RF power amplifier of claim 2, wherein the first and second output transformers are balun transformers having an output impedance of 25 ohms.

4. The RF power amplifier of claim 1, wherein drain-to-source voltages of the first plurality of field effect transistors and the second plurality of field effect transistors are greater than 50 VDC.

5. The RF power amplifier of claim 1, wherein the first amplifier module includes a plurality of DC-blocking transformers, and wherein the second amplifier module includes a plurality of DC-blocking transformers.

6. The RF power amplifier of claim 1, wherein the first and second output transformers are balun transformers having an output impedance of 25 ohms.

7. The RF power amplifier of claim 1, further comprising temperature compensating bias circuitry for providing a temperature compensated bias voltage to at least one of the first push-pull amplifier and the second push-pull amplifier for decreasing a field effect transistor bias voltage as transistor temperature increases, the temperature compensating bias circuitry comprising:

a temperature sensor generating a temperature signal;

a first amplifier having an output providing a first temperature dependent voltage based on the temperature signal; and

a potentiometer connected to the output of the first amplifier such that a voltage across the potentiometer remains substantially constant when the first temperature dependent voltage changes; and

a bias output connected to the at least one of the first push-pull amplifier and the second push-pull amplifier and supplying the temperature compensated bias voltage to the at least one of the first push-pull amplifier and the second push-pull amplifier.

8. The RF power amplifier of claim 7, wherein the temperature compensating bias circuitry further comprises a second amplifier having an output providing a second temperature dependent voltage based on the temperature signal,

wherein the first temperature dependent voltage and the second temperature dependent voltage change at substantially the same rate in response to the temperature signal, and

wherein the potentiometer is connected to the output of the first amplifier and the output of the second amplifier such that the voltage across the potentiometer remains substantially constant when the first temperature dependent voltage and the second temperature dependent voltage change.

9. The RF power amplifier of claim 7, further comprising a follower transistor connected to the potentiometer, wherein the follower transistor generates the bias output.

10. The RF power amplifier of claim 7, wherein the temperature sensor is a transistor.

11. The RF power amplifier of claim 7, wherein the temperature sensor comprises a temperature sensor integrated circuit.

12. The RF power amplifier of claim 7, wherein the temperature sensor comprises a thermistor.

13. An RF power amplifier, comprising:

a first amplifier module comprising a first push-pull amplifier including a first plurality of transistors and a first output transformer, wherein an output impedance of the first amplifier module is 25 ohms;

a second amplifier module comprising a second push-pull amplifier including a second plurality of transistors and a second output transformer, wherein an output impedance of the second amplifier module is 25 ohms;

a combiner connected to the first amplifier module and the second amplifier module, wherein the combiner combines an output from the first amplifier module and an output from the second amplifier module into a combined signal, and wherein an output impedance of the combiner is 50 ohms; and

temperature compensating bias circuitry for providing a temperature compensated bias voltage to at least one of the first push-pull amplifier and the second push-pull amplifier for decreasing a transistor bias voltage as transistor temperature increases, the temperature compensating bias circuitry comprising;

a temperature sensor generating a temperature signal;

a first amplifier having an output providing a first temperature dependent voltage based on the temperature signal; and

a potentiometer connected to the output of the first amplifier such that a voltage across the potentiometer remains substantially constant when the first temperature dependent voltage changes; and

a bias output connected to the at least one of the first push-pull amplifier and the second push-pull amplifier and supplying the temperature compensated bias voltage to the at least one of the first push-pull amplifier and the second push-pull amplifier.

14. The RF power amplifier of claim 13, wherein the temperature compensating bias circuitry further comprises a second amplifier having an output providing a second temperature dependent voltage based on the temperature signal,

wherein the first temperature dependent voltage and the second temperature dependent voltage change at substantially the same rate in response to the temperature signal, and

wherein the potentiometer is connected to the output of the first amplifier and the output of the second amplifier such that the voltage across the potentiometer remains substantially constant when the first temperature dependent voltage and the second temperature dependent voltage change.

15. The RF power amplifier of claim 13, further comprising a follower transistor connected to the potentiometer, wherein the follower transistor generates the bias output.

16. The RF power amplifier of claim 13, wherein the temperature sensor is a transistor.

17. The RF power amplifier of claim 13, wherein the temperature sensor comprises a temperature sensor integrated circuit.

18. The RF power amplifier of claim 13, wherein the temperature sensor comprises a thermistor.