ANTENNA, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING ANTENNA

• US 20110309904A1
• Filed: 06/10/2011
• Published: 12/22/2011
• Est. Priority Date: 06/18/2010
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: AOKI, Tomoyuki, EGUCHI, Shingo, SEKIGUCHI, Susumu
• Granted Patent: US 8,528,827 B2
• Time in Patent Office: Days
• US Class Current: 336/105
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07773 Antenna details antennas for wireless devices, e.g. RFID tags, in general H01Q1/22
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01F 5/003 Printed circuit coils
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

In an antenna and a semiconductor device including the antenna, an object is to reduce the distance between electrodes of a capacitor as much as possible, reduce the area of the electrode of the capacitor as much as possible, and prevent the suppression of response sensitivity and a response range of the semiconductor device. The present invention relates to an antenna including an antenna coil provided over a first region of a base and a capacitor which uses a second region of the base as a dielectric body and which has electrodes provided for opposite planes of the second region of the base, wherein the second region of the base is thinner than the first region of the base, and also relates to a semiconductor device including the antenna.

Claims

1. An antenna comprising:

an antenna coil provided over a first region of a base; and

a capacitor including a second region of the base as a dielectric body, a first electrode and a second electrode, the first electrode provided over a first side of the second region of the base, and the second electrode provided over a second side of the second region of the base,

wherein the second region of the base is thinner than the first region of the base.

2. The antenna according to claim 1,

wherein the base is a film containing any one of polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, and polyimide.

3. A semiconductor device comprising:

a first antenna coil provided over a first region of a base;

a capacitor including a second region of the base as a dielectric body, a first electrode and a second electrode, the first electrode provided over a first side of the second region of the base, and the second electrode provided over a second side of the second region of the base; and

a chip including a semiconductor integrated circuit and a second antenna coil,

wherein the second region of the base is thinner than the first region of the base.

4. The semiconductor device according to claim 3,

wherein the base is a film containing any one of polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, and polyimide.

5. A method of manufacturing an antenna including an antenna coil and a capacitor, comprising the steps of:

rotating a roller having a projection portion while pressing the roller onto a base with a first thickness;

providing the base with a dielectric body of the capacitor by pressing the projection portion onto a first plane of the base, the dielectric body having a second thickness smaller than the first thickness;

forming an opening in the base;

forming a first conductive material over a first plane of a region with the second thickness, inside the opening, and over the first plane of the base;

forming a second conductive material over the first plane of the base and a second plane thereof on an opposite side; and

heating the first conductive material and the second conductive material so as to form the antenna coil and an electrode of the capacitor.

6. The method of manufacturing an antenna according to claim 5,

wherein the base is a film containing any one of polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, and polyimide.

7. The method of manufacturing an antenna according to claim 5,

wherein each of the first conductive material and the second conductive material includes at least one of silver (Ag), gold (Au), copper (Cu), nickel (Ni), platinum (Pt), palladium (Pd), tantalum (Ta), molybdenum (Mo), and titanium (Ti).

8. The method of manufacturing an antenna according to claim 5,

wherein the opening is formed by a laser.

9. The method of manufacturing an antenna according to claim 5,

wherein the opening is formed by a cutter knife.

10. A method of manufacturing an antenna including an antenna coil and a capacitor, comprising the steps of:

irradiating a first plane of a base having a first thickness by a laser beam to provide a dielectric body of the capacitor having a second thickness smaller than the first thickness;

forming an opening in the base;

forming a first conductive material over the first plane of a region with the second thickness, inside the opening, and over the first plane of the base;

forming a second conductive material over the first plane of the base and a second plane thereof on an opposite side of the base; and

heating the first conductive material and the second conductive material so as to form the antenna coil and an electrode of the capacitor.

11. The method of manufacturing an antenna according to claim 10,

wherein the base is a film containing any one of polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, and polyimide.

12. The method of manufacturing an antenna according to claim 10,

wherein each of the first conductive material and the second conductive material includes at least one of silver (Ag), gold (Au), copper (Cu), nickel (Ni), platinum (Pt), palladium (Pd), tantalum (Ta), molybdenum (Mo), and titanium (Ti).

13. The method of manufacturing an antenna according to claim 10,

wherein the opening is formed by a laser.

14. The method of manufacturing an antenna according to claim 10,

wherein the opening is formed by a cutter knife.