Methods for Attaching Flexible Substrates to Rigid Carriers and Resulting Devices
First Claim
1. A method for attaching a flexible substrate to a rigid carrier, comprising(a) depositing a joining material at one or more contact points between a flexible substrate and a rigid carrier;
- (b) contacting the flexible substrate and the rigid carrier at the one or more contact points; and
(c) exposing the one or more contact points to a temperature of between 219°
C. and 1000°
C. and under conditions suitable for attaching the flexible substrate and the rigid carrier at the one or more contact points via the joining material.
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Accused Products
Abstract
Flexible substrates can be temporarily attached to a rigid carrier for processing a surface thereof by depositing a joining material at one or more contact points between a flexible substrate and a rigid carrier, contacting the flexible substrate and the rigid carrier at the one or more contact points; and exposing the one or more contact points to a temperature of between 219° C. and 1000° C. and under conditions suitable for attaching the flexible substrate and the rigid carrier at the one or more contact points via the joining material. Examples of suitable joining materials include, but are not limited to soldering or brazing materials. Such supported substrates can be used for preparing flexible displays comprising at least one electronic component and/or circuit on a surface of the flexible display.
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Citations
56 Claims
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1. A method for attaching a flexible substrate to a rigid carrier, comprising
(a) depositing a joining material at one or more contact points between a flexible substrate and a rigid carrier; -
(b) contacting the flexible substrate and the rigid carrier at the one or more contact points; and (c) exposing the one or more contact points to a temperature of between 219°
C. and 1000°
C. and under conditions suitable for attaching the flexible substrate and the rigid carrier at the one or more contact points via the joining material. - View Dependent Claims (2, 4, 5, 7, 11, 14)
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3. (canceled)
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6. (canceled)
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8-10. -10. (canceled)
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12-13. -13. (canceled)
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15-17. -17. (canceled)
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18. An assembly comprising:
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(a) a flexible substrate; (b) a rigid carrier; and (c) a plurality of discrete contact points between the flexible substrate and the rigid carrier, wherein the contact points comprise a joining material with a melting temperature between 219°
C. and 1000°
C., and wherein the flexible substrate and the rigid carrier have a melting temperature greater that the melting temperature of the joining material. - View Dependent Claims (20, 21, 22, 23, 26, 28, 29)
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19. (canceled)
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24-25. -25. (canceled)
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27. (canceled)
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30. (canceled)
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31. An assembly, comprising
(a) a flexible substrate; -
(b) a rigid carrier; and (c) a joining material at one or more contact points between the flexible substrate and the rigid carrier, wherein the joining material has a melting temperature between 219°
C. and 1000°
C., and wherein the flexible substrate and the rigid carrier have a melting temperature greater that the melting temperature of the joining material, and wherein the assembly has a bow of less than 150 μ
m. - View Dependent Claims (33, 34, 35, 36, 39, 43)
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32. (canceled)
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37-38. -38. (canceled)
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40-42. -42. (canceled)
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44. A method for attaching a plastic flexible substrate to a rigid carrier, comprising
(a) depositing a joining material on a surface of the rigid carrier at one or more contact points between the plastic flexible substrate and a rigid carrier; -
(b) aligning a metalized surface of the plastic flexible substrate and the joining material on the surface of the rigid carrier surface, wherein the metallization is present on a surface of the flexible substrate at the one or more contact points; (c) contacting the plastic flexible substrate and the rigid carrier at the one or more contact points; and (d) exposing the one or more contact points to a temperature of between 219°
C. and 1000°
C. and under conditions suitable for attaching the plastic flexible substrate and the rigid carrier at the one or more contact points via the joining material. - View Dependent Claims (45, 47, 48, 49, 50, 55)
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46. (canceled)
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51-54. -54. (canceled)
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56-58. -58. (canceled)
Specification