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Methods for Attaching Flexible Substrates to Rigid Carriers and Resulting Devices

  • US 20110311789A1
  • Filed: 09/10/2009
  • Published: 12/22/2011
  • Est. Priority Date: 09/12/2008
  • Status: Abandoned Application
First Claim
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1. A method for attaching a flexible substrate to a rigid carrier, comprising(a) depositing a joining material at one or more contact points between a flexible substrate and a rigid carrier;

  • (b) contacting the flexible substrate and the rigid carrier at the one or more contact points; and

    (c) exposing the one or more contact points to a temperature of between 219°

    C. and 1000°

    C. and under conditions suitable for attaching the flexible substrate and the rigid carrier at the one or more contact points via the joining material.

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