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MICROSTRUCTURE AND MICROSTRUCTURE PRODUCTION METHOD

  • US 20110311800A1
  • Filed: 06/21/2011
  • Published: 12/22/2011
  • Est. Priority Date: 06/22/2010
  • Status: Abandoned Application
First Claim
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1. A microstructure comprising through-holes formed in an insulating matrix filled with a metal and an insulating substance,wherein the through-holes have a density of 1×

  • 106 to 1×

    1010 holes/mm2, a mean opening diameter of 10 nm to 5000 nm, and a mean depth of 10 μ

    m to 1000 μ

    m,wherein the sealing ratio of the through-holes as attained by the metal alone is 80% or more,wherein the sealing ratio of the through-holes as attained by the metal and the insulating substance is 99% or more, andwherein the insulating substance is at least one kind selected from the group consisting of aluminum hydroxide, silicon dioxide, metal alkoxide, lithium chloride, titanium oxide, magnesium oxide, tantalum oxide, niobium oxide, and zirconium oxide.

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