TOUCH PANEL

• US 20110315536A1
• Filed: 03/02/2011
• Published: 12/29/2011
• Est. Priority Date: 06/29/2010
• Status: Abandoned Application

• Current Assignee: UniDisplay Inc. (Unimicron Technology Corporation)
• Original Assignee: UniDisplay Inc. (Unimicron Technology Corporation)
• Inventors: Chiou, Jeng-Maw, Tsou, Te-Hao, Lin, Biing-Nan, Tseng, Tzyy-Jang
• Application Number:
  US13/038,389
• Publication Number:
  US 20110315536A1
• Time in Patent Office: Days
• US Class Current: 200/600
• CPC Class Codes: G06F 2203/04112 Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
• CPC Class Codes: G06F 2203/04113 Peripheral electrode pattern in resistive digitisers, i.e. electrodes at the periphery of the resistive sheet are shaped in patterns enhancing linearity of induced field
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/043 using propagating acoustic waves
• CPC Class Codes: G06F 3/044 by capacitive means
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• CPC Class Codes: G06F 3/046 by electromagnetic means

Abstract

A touch panel including a substrate, a first patterned conductive layer, a second patterned conductive layer and a circuit board is provided. The substrate has a first surface, a second surface, a first bonding area and a second bonding area. The first patterned conductive layer disposed on the first surface includes first sensing series electrically insulated from each other. The second patterned conductive layer disposed on the second surface includes second sensing series electrically insulated from each other. The circuit board includes a rigid portion, a first flexible bonding portion and a second flexible bonding portion. The first flexible bonding portion and the second flexible bonding portion are electrically connected to the rigid portion. The first flexible bonding portion is electrically connected to the first sensing series in the first bonding area. The second flexible bonding portion is electrically connected to the second sensing series in the second bonding area.

Claims

1. A touch panel, comprising:

a substrate having a first surface, a second surface, a first bonding area located at an edge of the first surface and a second bonding area located at an edge of the second surface;

a first patterned conductive layer disposed on the first surface and comprising a plurality of first sensing series electrically insulated from each other, wherein an end of each first sensing series extends to the first bonding area;

a second patterned conductive layer disposed on the second surface and comprising a plurality of second sensing series electrically insulated from each other, wherein an end of each second sensing series extends to the second bonding area; and

a circuit board comprising a rigid portion, a first flexible bonding portion and a second flexible bonding portion, wherein the first flexible bonding portion and the second flexible bonding portion are electrically connected to the rigid portion, the first flexible bonding portion is electrically connected to the first sensing series in the first bonding area, and the second flexible bonding portion is electrically connected to the second sensing series in the second bonding area.

2. The touch panel as claimed in claim 1, wherein a material of the substrate comprises glass, polycarbonate (PC), polymethyl methacrylate (PMMA) or polyethylene terephthalate (PET).

3. The touch panel as claimed in claim 1, wherein the substrate is a transparent substrate, an opaque substrate or a translucent substrate.

4. The touch panel as claimed in claim 1, wherein a thickness of the substrate is between about 0.1 mm and about 2 mm.

5. The touch panel as claimed in claim 1, wherein each of the first sensing series comprises:

a plurality of first sensing pads; and

a plurality of first bridge portions, wherein each of the first bridge portions is electrically connected between two neighboring first sensing pads.

6. The touch panel as claimed in claim 1, wherein each of the second sensing series comprises:

a plurality of second sensing pads; and

a plurality of second bridge portions, wherein each of the second bridge portions is electrically connected between two neighboring second sensing pads.

7. The touch panel as claimed in claim 1, wherein a material of the first patterned conductive layer and the second patterned conductive layer comprises indium tin oxide (ITO), transparent conducting oxide (TCO) or a transparent conductive material containing nano-materials.

8. The touch panel as claimed in claim 1, wherein the first patterned conductive layer is a transparent patterned conductive layer, an opaque patterned conductive layer or a translucent patterned conductive layer.

9. The touch panel as claimed in claim 1, wherein the second patterned conductive layer is a transparent patterned conductive layer, an opaque patterned conductive layer or a translucent patterned conductive layer.

10. The touch panel as claimed in claim 1, wherein the rigid portion of the circuit board comprises a plurality of conductive layers and dielectric layers stacked alternately, and a part of the conductive layers and the dielectric layers in the rigid portion extends outward to form the first flexible bonding portion and the second flexible bonding portion.

11. The touch panel as claimed in claim 1, wherein a shape of the rigid portion of the circuit board comprises an L-shape.

12. The touch panel as claimed in claim 1, further comprising at least a chip disposed on the rigid portion of the circuit board, wherein the chip is electrically connected to the circuit board.

13. The touch panel as claimed in claim 1, further comprising a control circuit electrically connected to the circuit board, wherein the first patterned conductive layer and the second patterned conductive layer are electrically connected to the control circuit through the circuit board.

14. The touch panel as claimed in claim 13, further comprising at least a chip disposed on the control circuit, wherein the chip is electrically connected to the control circuit.

15. The touch panel as claimed in claim 1, further comprising two anisotropic conductive films respectively disposed between the end of the first sensing series and the first flexible bonding portion of the circuit board, and between the end of the second sensing series and the second flexible bonding portion of the circuit board.

16. The touch panel as claimed in claim 1, further comprising a support board, wherein the circuit board is disposed on the support board, and the support board surrounds the substrate.

17. The touch panel as claimed in claim 16, wherein a shape of the support board comprises an L-shape, a -shape or a □

-shape.

18. The touch panel as claimed in claim 1, further comprising at least a protection film disposed on the substrate, wherein the protection film covers the first patterned conductive layer or the second patterned conductive layer.

19. The touch panel as claimed in claim 18, wherein the protection film comprises an anti-reflection film, an anti-glare film, an anti-grease film or a circuit visibility reduction film.

20. A touch panel, comprising:

a substrate having a first surface, a second surface, a first bonding area located at an edge of the first surface and a second bonding area located at an edge of the second surface;

a first patterned conductive layer disposed on the first surface and comprising a plurality of first sensing series electrically insulated from each other, wherein an end of each first sensing series extends to the first bonding area;

a second patterned conductive layer disposed on the second surface and comprising a plurality of second sensing series electrically insulated from each other, wherein an end of each second sensing series extends to the second bonding area;

a first circuit board comprising a first rigid portion and a first flexible bonding portion electrically connected to the first rigid portion, wherein the first flexible bonding portion is electrically connected to the first sensing series in the first bonding area;

a second circuit board comprising a second rigid portion and a second flexible bonding portion electrically connected to the second rigid portion, wherein the second flexible bonding portion is electrically connected to the second sensing series in the second bonding area; and

a connection circuit electrically connected to the first rigid portion and the second rigid portion.

21. The touch panel as claimed in claim 20, wherein a material of the substrate comprises glass, polycarbonate (PC), polymethyl methacrylate (PMMA) or polyethylene terephthalate (PET).

22. The touch panel as claimed in claim 20, wherein the substrate is a transparent substrate, an opaque substrate or a translucent substrate.

23. The touch panel as claimed in claim 20, wherein a thickness of the substrate is between about 0.1 mm and about 2 mm.

24. The touch panel as claimed in claim 20, wherein each of the first sensing series comprises:

a plurality of first sensing pads; and

a plurality of first bridge portions, wherein each of the first bridge portions is electrically connected between two neighboring first sensing pads.

25. The touch panel as claimed in claim 20, wherein each of the second sensing series comprises:

a plurality of second sensing pads; and

a plurality of second bridge portions, wherein each of the second bridge portions is electrically connected between two neighboring second sensing pads.

26. The touch panel as claimed in claim 20, wherein a material of the first patterned conductive layer and the second patterned conductive layer comprises indium tin oxide (ITO), transparent conducting oxide (TCO) or a transparent conductive material containing nano-materials.

27. The touch panel as claimed in claim 20, wherein the first patterned conductive layer is a transparent patterned conductive layer, an opaque patterned conductive layer or a translucent patterned conductive layer.

28. The touch panel as claimed in claim 20, wherein the second patterned conductive layer is a transparent patterned conductive layer, an opaque patterned conductive layer or a translucent patterned conductive layer.

29. The touch panel as claimed in claim 20, wherein the first rigid portion of the first circuit board and the second rigid portion of the second circuit board respectively comprise a plurality of conductive layers and dielectric layers stacked alternately, and a part of the conductive layers and the dielectric layers in the first rigid portion and the second rigid portion extend outward to form the first flexible bonding portion and the second flexible bonding portion.

30. The touch panel as claimed in claim 20, wherein shapes of the first rigid portion of the first circuit board and the second rigid portion of the second circuit board comprise strip shapes.

31. The touch panel as claimed in claim 20, further comprising at least a chip disposed on the connection circuit, wherein the chip is electrically connected to the connection circuit.

32. The touch panel as claimed in claim 20, further comprising a control circuit electrically connected to the connection circuit, wherein the first patterned conductive layer and the second patterned conductive layer are electrically connected to the control circuit through the first circuit board, the second circuit board and the connection circuit.

33. The touch panel as claimed in claim 20, wherein the connection circuit comprises a flexible printed circuit.

34. The touch panel as claimed in claim 20, further comprising two anisotropic conductive films respectively disposed between the end of the first sensing series and the first flexible bonding portion of the first circuit board, and between the end of the second sensing series and the second flexible bonding portion of the second circuit board.

35. The touch panel as claimed in claim 20, further comprising a support board, wherein at least the first circuit board and the second circuit board are disposed on the support board, and the support board surrounds the substrate.

36. The touch panel as claimed in claim 35, wherein a shape of the support board comprises an L-shape, a -shape or a □

-shape.

37. The touch panel as claimed in claim 20, further comprising at least a protection film disposed on the substrate, wherein the protection film covers the first patterned conductive layer or the second patterned conductive layer.

38. The touch panel as claimed in claim 37, wherein the protection film comprises an anti-reflection film, an anti-glare film, an anti-grease film or a circuit visibility reduction film.

39. The touch panel as claimed in claim 20, wherein the first circuit board further comprises a third flexible bonding portion, the second circuit board further comprises a fourth flexible bonding portion, and the first circuit board and the second circuit board are electrically connected by connecting the third flexible bonding portion and the fourth flexible bonding portion.

40. The touch panel as claimed in claim 20, wherein the second circuit board further comprises a fourth flexible bonding portion, and the fourth flexible bonding portion is connected to the first rigid portion of the first circuit board.