SEMICONDUCTOR MODULE WITH RESIN-MOLDED PACKAGE OF HEAT SPREADER AND POWER SEMICONDUCTOR CHIP

• US 20110316142A1
• Filed: 06/22/2011
• Published: 12/29/2011
• Est. Priority Date: 06/23/2010
• Status: Abandoned Application

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: NORITAKE, Chikage, HIRAIWA, Naoki, ARAI, Tsuyoshi
• Application Number:
  US13/166,101
• Publication Number:
  US 20110316142A1
• Time in Patent Office: Days
• US Class Current: 257/713
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 23/051 another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/117 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/1815 Shape

Abstract

A semiconductor module is provided which includes a resin molded package which is made by a resinous mold assembly. The resin molded package is clamped by covers through a fastener to make the semiconductor module. The resinous mold assembly has formed therein a coolant path that is a portion of a coolant passage through which a coolant flows to coal a semiconductor chip embedded in the resin molded package. The resinous mold assembly is made up of a first mold and a second mold. The first mold has the semiconductor chip, heat spreaders, and electric terminals embedded therein. The second mold is wrapped around an outer periphery of the first mold. The second mold is made of resin which is lower in softening temperature than that of the first mold, thereby facilitating ease of removing the first mold from the resin molded package for reusing the resin molded package.

Claims

1. A semiconductor module comprising:

a resin molded package which includes a resinous mold assembly, the resinous mold assembly having embedded therein a power semiconductor chip which has a first and a second surfaces opposed to each other, a first heat spreader disposed in connection with the first surface of the power semiconductor chip, a second heat spreader disposed in connection with the second surface of the power semiconductor chip, and electric terminals connected with the power semiconductor chip, the resinous mold assembly also having formed therein a coolant path through which a coolant flows to cool the power semiconductor chip;

a first cover disposed on a first surface of the resin molded package;

a second cover disposed on a second surface of the resin molded package; and

a fastener which fastens the first and second covers to hold the resin molded package,

wherein the resinous mold assembly of the resin molded package includes a first mold and a second mold, the first mold having the power semiconductor chip, the first and second heat spreaders, and the electric terminals embedded therein, such that a portion of each of the electric terminals is exposed outside the resinous mold assembly, and a surface of each of the first and second spreaders which is located opposite the power semiconductor chip is also exposed outside the resinous mold assembly, the second mold covering an outer periphery of the first mold, the first mold being made of a first resin material, the second mold being made of a second resin material which is lower in softening temperature than the first resin material.

2. A semiconductor module as set forth in claim 1, wherein the first resin material is a thermosetting resin, while the second resin material is a thermoplastic resin.

3. A semiconductor module as set forth in claim 2, wherein the thermosetting resin is one of epoxy, phenol, and silicone resin.

4. A semiconductor module as set forth in claim 2, wherein the thermoplastic resin is one of polyphenylene sulfide, polybutylene terephthalate, nylon, polyethylene, and polypropylene.

5. A semiconductor module as set forth in claim 1, further comprising a rubber member secured to an interface between the first and second molds to create a hermetical seal therebetween.

6. A semiconductor module comprising:

a plurality of resin molded packages each of which is made by a resinous mold assembly, the resin molded packages being laid to overlap each other as a package stack, the resinous mold assembly having embedded therein a power semiconductor chip which has a first and a second surfaces opposed to each other, a first heat spreader disposed in connection with the first surface of the power semiconductor chip, a second heat spreader disposed in connection with the second surface of the power semiconductor chip, and electric terminals connected electrically with the power semiconductor chip, the resinous mold assembly also having formed therein a coolant path that is a portion of a coolant passage through which a coolant flows to cool the semiconductor chips;

a first cover disposed on a first surface of the package stack;

a second cover disposed on a second surfaced of the package stack; and

a fastener which fastens the first and second covers to hold the package stack,

wherein the resinous mold assembly of each of the resin molded packages includes a first mold and a second mold, the first mold having the power semiconductor chip, the first and second heat spreaders, and the electric terminals embedded therein, such that a portion of each of the electric terminals is exposed outside the resinous mold assembly, and a surface of each of the first and second spreaders which is located opposite the power semiconductor chip is also exposed outside the resinous mold assembly, the second mold covering an outer periphery of the first mold, the first mold being made of a first resin material, the second mold being made of a second resin material which is lower in softening temperature than the first resin material.

7. A semiconductor module as set forth in claim 6, wherein the first resin material is a thermosetting resin, while the second resin material is a thermoplastic resin.

8. A semiconductor module as set forth in claim 7, wherein the thermosetting resin is one of epoxy, phenol, and silicone resin.

9. A semiconductor module as set forth in claim 7, wherein the thermoplastic resin is one of polyphenylene sulfide, polybutylene terephthalate, nylon, polyethylene, and polypropylene.

10. A semiconductor module as set forth in claim 6, further comprising a rubber member which is secured to an interface between the first and second molds of each of the resin molded packages to create a hermetical seal therebetween.