ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE WITH BUILT-IN TOUCH PANEL

• US 20110316802A1
• Filed: 06/24/2011
• Published: 12/29/2011
• Est. Priority Date: 06/25/2010
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Choi, Ho-Won
• Granted Patent: US 9,158,396 B2
• Time in Patent Office: Days
• US Class Current: 345/173
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: H10K 59/40 OLEDs integrated with touch screens

Abstract

An OLED display device has a built-in touch panel and includes an upper substrate and a lower substrate arranged opposite to each other, a thin film transistor array formed on the lower substrate, an organic light emitting array formed on the thin film transistor array, a touch sensor array formed on the upper substrate opposite to the lower substrate for sensing external touch by a capacitive type, an upper touch pad formed on the upper substrate to be connected to the touch sensor array, a lower touch pad formed on the lower substrate opposite to the plurality of upper touch pads, a conductive spacer connected between the upper touch pad and the lower touch pad, and a signal transmission film electrically connected to a main pad formed on the lower substrate and the lower touch pad for supplying signals for controlling the thin film transistor array and the touch sensor array.

Claims

1. An OLED display device having a built-in touch panel comprising:

an upper substrate and a lower substrate arranged opposite to each other;

a thin film transistor array on the lower substrate;

an organic light emitting array on the thin film transistor array;

a touch sensor array on the upper substrate opposite to the lower substrate for sensing external touch by a capacitive type;

an upper touch pad on the upper substrate connected to the touch sensor array;

a lower touch pad on the lower substrate opposite to the plurality of upper touch pads;

a conductive spacer connected between the upper touch pad and the lower touch pad; and

a signal transmission film electrically connected to a main pad on the lower substrate and the lower touch pad that supplies signals that control the thin film transistor array and the touch sensor array.

2. The device as claimed in claim 1, wherein the upper substrate and the lower substrate are bonded face sealed with an adhesive film, which is formed of an insulating material.

3. The device as claimed in claim 2, wherein the adhesive film comprises a transparent film and has an adhesive force owing to an adhesive material.

4. The device as claimed in claim 3, wherein the adhesive film has a thickness of about 5˜

about 100 μ

m.

5. The device as claimed in claim 1, wherein the conductive spacer comprises a silver dot.

6. The device as claimed in claim 1, wherein the lower touch pad is on one side of the lower substrate, the main pad is on the other side of the lower substrate, and the lower touch pad is electrically connected to the main pad with a connection line formed on the lower substrate.

7. The device as claimed in claim 1, wherein the upper substrate and the lower substrate are bonded as only an outer portion of the upper substrate.

8. The device as claimed in claim 7, wherein the sealing material has a height of about 5˜

about 100 μ

m.

9. The device as claimed in claim 3, wherein the adhesive film comprises an epoxy.

10. The device as claimed in claim 3, wherein the adhesive film comprises a silicone.

11. The device as claimed in claim 1, wherein the conductive spacer comprises a sealant containing conductive balls.

12. The device as claimed in claim 7, wherein the lower substrate is sealed with a sealing material of Frit or Epoxy.

13. The device as claimed in claim 7, wherein the sealing material comprises one of Frit or Epoxy.

14. The device as claimed in claim 12, wherein the sealing material comprises one of Frit or Epoxy.