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Power semiconductor module

  • US 20120001227A1
  • Filed: 06/14/2011
  • Published: 01/05/2012
  • Est. Priority Date: 06/18/2010
  • Status: Active Grant
First Claim
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1. A power semiconductor module, comprising:

  • a plurality of sets of semiconductor switching elements;

    a molded resin casing with a box shape containing the plurality of sets of semiconductor switching elements;

    screw holders for receiving mounting screws, formed at bottom regions of four corners of the molded resin casing;

    first terminal blocks having main circuit terminals, and arranged on a central region of a top surface of the molded resin casing;

    second terminal blocks having control terminals arranged in a row at a side edge of the molded resin casing apart from the first terminal blocks and drawn out from the sets of the semiconductor switching elements; and

    insulating separation walls having a configuration of a rib erecting from a surface of the second terminal blocks for the control terminals and interposing between groups of the control terminals corresponding to the sets of semiconductor switching elements, and between the screw holder including the mounting screw therein on the molded resin casing and the control terminal at a high voltage side adjacent to the screw holder.

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