ETCHANTS AND METHODS OF FABRICATING SEMICONDUCTOR DEVICES USING THE SAME
First Claim
1. A method of fabricating a semiconductor device, the method comprising:
- forming a plurality of gate patterns on a substrate;
forming first insulation layers between the gate patterns;
wet-etching the first insulation layers to form first insulation residues; and
forming air gaps between the plurality of gate patterns.
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Accused Products
Abstract
Provided according to embodiments of the present invention are methods of fabricating semiconductor devices using an etchant. In some embodiments, the etchant may be highly selective and may act to reduce interference between wordlines in the semiconductor device. In some embodiments of the invention, provided are methods of fabricating a semiconductor device that include forming a plurality of gate patterns on a substrate; forming first insulation layers between the gate patterns; wet-etching the first insulation layers to form first insulation layer residues; and forming air gaps between the plurality of gate patterns. Related etchant solutions and semiconductor devices are also provided.
27 Citations
24 Claims
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1. A method of fabricating a semiconductor device, the method comprising:
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forming a plurality of gate patterns on a substrate; forming first insulation layers between the gate patterns; wet-etching the first insulation layers to form first insulation residues; and forming air gaps between the plurality of gate patterns. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of fabricating a semiconductor device, the method comprising:
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forming a plurality of gate patterns on a substrate; forming a first oxide layer on the substrate and on the gate patterns; forming nitride layers between the gate patterns; forming a residue of the nitride layers by etching the nitride layers using an etchant comprising phosphoric acid (H3PO4) and silicon phosphate (Si3(PO4)4); and forming second oxide layers by heating the residue, wherein air gaps are formed between the plurality of gate patterns. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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- 19. An etchant comprising phosphoric acid (H3PO4) and silicon phosphate (Si3(PO4)4).
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21-23. -23. (canceled)
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24. A semiconductor device comprising
a plurality of gate patterns; - and
a silicon dioxide layer on the plurality of gate patterns; and air gaps enclosed by the gate patterns and the silicon dioxide layer thereon.
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Specification