SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME
First Claim
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1. A method of manufacturing a semiconductor device, the method comprising:
- forming a laminated structure including sacrificial layers and a select gate layer on a substrate;
forming a penetration region penetrating the laminated structure;
forming a select gate insulating layer on a sidewall of the select gate layer exposed by the penetration region;
forming an active pattern in the penetration region;
exposing a portion of the active pattern by removing the sacrificial layers; and
forming an information storage layer on the exposed portion of the active pattern.
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Abstract
A method of manufacturing a semiconductor device includes forming a laminated structure including sacrificial layers and a select gate layer on a substrate, forming a penetration region penetrating the laminated structure, forming a select gate insulating layer on a sidewall of the select gate layer exposed by the penetration region, and forming an active pattern in the penetration region. The method also includes exposing a portion of the active pattern by removing the sacrificial layers and forming an information storage layer on the exposed portion of the active pattern.
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Citations
16 Claims
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1. A method of manufacturing a semiconductor device, the method comprising:
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forming a laminated structure including sacrificial layers and a select gate layer on a substrate; forming a penetration region penetrating the laminated structure; forming a select gate insulating layer on a sidewall of the select gate layer exposed by the penetration region; forming an active pattern in the penetration region; exposing a portion of the active pattern by removing the sacrificial layers; and forming an information storage layer on the exposed portion of the active pattern. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of manufacturing a three-dimensional semiconductor memory device, the method comprising:
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forming a laminated structure including sacrificial layers and a select gate layer such that the sacrificial layers and the select gate layer are stacked in a first direction; forming a penetration region penetrating the laminated structure such that the penetration region extends through the sacrificial layers and the select gate layer in the first direction; forming a select gate insulating layer on a sidewall of the select gate layer exposed by the penetration region, the sidewall of the select gate layer extending in the first direction; forming an active pattern in the penetration region such that the active pattern extends through the sacrificial layers and the select gate layer in the first direction; exposing a portion of the active pattern by removing the sacrificial layers; and forming an information storage layer on the exposed portion of the active pattern. - View Dependent Claims (12, 13, 14, 15)
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16-20. -20. (canceled)
Specification