Capacitive touch panel

• US 20120007824A1
• Filed: 07/06/2010
• Published: 01/12/2012
• Est. Priority Date: 05/11/2010
• Status: Active Grant

• Current Assignee: TPK Touch Solutions (Xiamen) Inc. (TPK Holding Co., Ltd.)
• Original Assignee: MasTouch Optoelectronics Technologies Co., Ltd. (TPK Holding Co., Ltd.)
• Inventors: MI, David
• Granted Patent: US 8,487,904 B2
• Time in Patent Office: Days
• US Class Current: 345/174
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: H03K 17/962 Capacitive touch switches

Abstract

A capacitive touch panel sequentially has a first glass substrate, a lower touch sensitive layer, a lower insulation ink layer, a lower conductor layer, a lower insulation layer, a lower conductive adhesive layer, a flexible circuit board, a transparent insulation adhesive layer, an upper insulation layer, an upper conductive adhesive layer, an upper conductor layer, an upper insulation ink layer, an upper touch sensitive layer and a second glass substrate. The aforementioned structure allows fabrication of the capacitive touch panel to be separated into a lower panel fabrication process and an upper panel fabrication process. The two independent fabrication processes prevent the capacitive touch panel from being damaged in one of the processes when the process is completed so as to increase the yield in production and further facilitate producing large-size touch panel.

Claims

1. A capacitive touch panel, comprising:

a first glass substrate having a first circuit surface;

a lower touch sensitive layer mounted on the first circuit surface of the first glass substrate;

a lower insulation ink layer mounted on an edge portion of the lower touch sensitive layer so as to let an uncovered portion of the lower touch sensitive layer constitute a touch area, and having a plurality of lower through slots formed through an portion of the lower insulation ink layer covering the edge portion of the lower touch sensitive layer and each filled in with a lower conductive layer;

a lower conductor layer mounted on the lower insulation ink layer and is electrically connected with the lower touch sensitive layer through the lower conductive layers filled in the corresponding lower through slots;

a lower insulation layer mounted on the lower conductor layer and having a lower indentation to partially expose the lower conductor layer;

a lower conductive adhesive layer mounted in the lower indentation of the lower insulation layer to cover the exposed portion of the lower conductor layer;

a flexible circuit board mounted on the lower conductive adhesive layer, extending outwardly beyond the first glass substrate, and electrically connected with the lower touch sensitive layer through the lower conductive adhesive layer and the lower conductive layers in the corresponding lower through slots;

a transparent insulation adhesive layer mounted on the touch area and the lower insulation layer;

an upper insulation layer mounted on the transparent insulation adhesive layer and having an upper indentation to expose the flexible circuit board;

an upper conductive adhesive layer mounted in the upper indentation of the upper insulation layer to contact with the flexible circuit board;

an upper conductor layer mounted on the upper conductive adhesive layer and the upper insulation layer;

an upper insulation ink layer mounted on the upper conductor layer, and having a plurality of upper through slots formed through the upper insulation ink layer and each filled in with a upper conductive layer having a color identical to that of the upper insulation ink layer;

an upper touch sensitive layer mounted on the transparent insulation adhesive layer, partially covering the upper insulation ink layer, and contacting with the upper conductive layers in the corresponding upper through slots of the upper insulation ink layer; and

a second glass substrate mounted on the upper touch sensitive layer and the upper insulation ink layer and having a second circuit surface in contact with the upper touch sensitive layer and the upper insulation ink layer.

2. The capacitive touch panel as claimed in claim 1, further comprising an upper protection layer, wherein

the flexible circuit board has a top surface and a bottom surface, wherein the bottom surface is attached on the lower conductive adhesive layer;

and

the upper protection layer is bonded to the top surface of the flexible circuit board and a side of the second glass substrate.

3. The capacitive touch panel as claimed in claim 1, further comprising a lower protection layer, wherein

the flexible circuit board has a bottom surface, wherein the bottom surface is attached on the lower conductive adhesive layer;

and

the lower protection layer is bonded to the bottom surface of the flexible circuit board and a side of the first glass substrate.

4. The capacitive touch panel as claimed in claim 2, further comprising a lower protection layer, wherein

the flexible circuit board has a bottom surface, wherein the bottom surface is attached on the lower conductive adhesive layer;

and

the lower protection layer is bonded to the bottom surface of the flexible circuit board and a side of the first glass substrate.

5. The capacitive touch panel as claimed in claim 1, wherein the lower conductive layer filled in each of the plurality of lower through slots of the lower insulation ink layer has a color identical to that of the lower insulation ink layer.

6. The capacitive touch panel as claimed in claim 1, wherein the lower conductive layer filled in each of the plurality of lower through slots of the lower insulation ink layer has a color different from that of the lower insulation ink layer.