DISPLAY DEVICE, METHOD FOR MANUFACTURING THE SAME AND APPARATUS FOR MANUFACTURING THE SAME
First Claim
1. A method for manufacturing a semiconductor device, comprising the steps of:
- forming an element over a substrate;
attaching a first sheet over the element while transferring the element;
separating the substrate from the element while transferring the element;
attaching a second sheet under the element while transferring the element after separating the substrate;
separating the first sheet from the element while transferring the element after attaching the second sheet;
processing the element after separating the first sheet; and
attaching a third sheet over the element while transferring the element after processing the element.
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Accused Products
Abstract
The present inventions provides a method for manufacturing a film-type display device efficiently, and a method for manufacturing a large-size film-type display device, and an apparatus for manufacturing the film-type display device. An apparatus for manufacturing a film-type display device includes: transferring means for transferring a substrate over which an integrated circuit constituting the display device is provided; first separating means for separating the integrated circuit from the substrate by adhering a first sheet material to one surface of the integrated circuit; second separating means for separating the integrated circuit from the first sheet material by adhering a second sheet material to the other surface of the integrated circuit; processing means for forming one or both of a conductive film and an insulating film on the integrated circuit; and sealing means for sealing the processed integrated circuit with the second sheet material and a third sheet material.
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Citations
15 Claims
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1. A method for manufacturing a semiconductor device, comprising the steps of:
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forming an element over a substrate; attaching a first sheet over the element while transferring the element; separating the substrate from the element while transferring the element; attaching a second sheet under the element while transferring the element after separating the substrate; separating the first sheet from the element while transferring the element after attaching the second sheet; processing the element after separating the first sheet; and attaching a third sheet over the element while transferring the element after processing the element. - View Dependent Claims (2, 3, 4, 5)
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6. A method for manufacturing a semiconductor device, comprising the steps of:
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forming an element over a substrate; attaching a first sheet over the element while transferring the element; separating the substrate from the element while transferring the element; attaching a second sheet under the element while transferring the element after separating the substrate; separating the first sheet from the element while transferring the element after attaching the second sheet; processing the element after separating the first sheet; attaching a third sheet over the element while transferring the element after processing the element; and reeling the element onto a correction roll after attaching the third sheet. - View Dependent Claims (7, 8, 9, 10)
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11. A method for manufacturing a semiconductor device, comprising the steps of:
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forming an element over a substrate; attaching a first sheet over the element while transferring the element; separating the substrate from the element while transferring the element; attaching a second sheet under the element while transferring the element after separating the substrate; separating the first sheet from the element while transferring the element after attaching the second sheet; processing the element after separating the first sheet; attaching a third sheet over the element while transferring the element after processing the element; and cutting the third sheet and the second sheet. - View Dependent Claims (12, 13, 14, 15)
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Specification