HEAT SINK WITH MULTIPLE VAPOR CHAMBERS

• US 20120012281A1
• Filed: 01/26/2010
• Published: 01/19/2012
• Est. Priority Date: 01/26/2010
• Status: Abandoned Application

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Franz, John P, Anthony, Sarah Nicole, Allen, Joseph R.
• Application Number:
  US13/258,994
• Publication Number:
  US 20120012281A1
• Time in Patent Office: Days
• US Class Current: 165/104.26
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink is disclosed. The heat sink comprises a base (102, 402) with at least one vapor chamber (208, 408) containing a fluid with a first activation point. The base has at least one vapor chamber (212, 412) containing a fluid with a second activation point. The first activation point is different than the second activation point.

Claims

1. A heat sink, comprising:

a base;

at least one vapor chamber inside the base having a fluid with a first activation point;

at least one vapor chamber inside the base having a fluid with a second activation point wherein the first activation point is different than the second activation point.

2. The heat sink of claim 1, wherein the fluid with the first activation point and the fluid with the second activation point are the same fluid.

3. The heat sink of claim 1, wherein a volume of the least one vapor chamber inside the base having a fluid with a first activation point is larger than a volume of the at least one vapor chamber inside the base having a fluid with a second activation point.

4. The heat sink of claim 1, wherein the first activation point is higher than the second activation point.

5. The heat sink of claim 1, wherein the at least one vapor chamber inside the base having a fluid with a second activation point is contained inside the at least one vapor chamber inside the base having a fluid with a first activation point.

6. The heat sink of claim 1, wherein the at least one vapor chamber inside the base having a fluid with a second activation point is comprised of at least one heat pipe.

7. The heat sink of claim 1, wherein the at least one vapor chamber inside the base having a fluid with a first activation point is comprised of at least one heat pipe.

8. The heat sink of claim 1, wherein:

the first activation point is between 60 and 80 degrees C. and the second activation point is between 35 and 65 degrees C.

9. The heat sink of claim 1, further comprising:

a least one vapor chamber inside the base having a fluid with a third activation point wherein the third activation point is different than the first or second activation point.

10. A method for cooling a component, comprising:

activating a fluid, inside a first vapor chamber in a heat sink mounted on the component, at a first temperature;

activating a fluid, inside a second vapor chamber in the heat sink mounted on the component, at a second temperature, wherein the first temperature is different than the second temperature.

11. The method for cooling a component of claim 10, wherein the fluid inside the first vapor chamber is a different fluid than the fluid inside the second vapor chamber.

12. The method for cooling a component of claim 10, wherein a volume of the first vapor chamber is larger than a volume of the second vapor chamber.

13. The method for cooling a component of claim 10, wherein the first vapor chamber and the second vapor chamber are heat pipes.

14. The method for cooling a component of claim 10, wherein the second vapor chamber is broken into at least two parts.

15. The method for cooling a component of claim 10, further comprising:

activating a fluid inside a third vapor chamber in the heat sink mounted on the component at a third temperature, wherein the third temperature is different than the first or second temperature.