Flexible Laminate and Flexible Electronic Circuit Board Formed by using the same

• US 20120012367A1
• Filed: 12/22/2009
• Published: 01/19/2012
• Est. Priority Date: 12/26/2008
• Status: Active Grant

• Current Assignee: JX Nippon Mining & Metals Corporation (ENEOS Holdings, Inc.)
• Original Assignee: JX Nippon Mining & Metals Corporation (ENEOS Holdings, Inc.)
• Inventors: Makino, Nobuhito, Inazumi, Hajime, Yoshida, Taku
• Granted Patent: US 8,487,191 B2
• Time in Patent Office: Days
• US Class Current: 174/254
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 2307/202 Conductive
• CPC Class Codes: B32B 2307/538 Roughness
• CPC Class Codes: B32B 2307/546 Flexural strength; Flexion stiffness
• CPC Class Codes: B32B 2307/732 Dimensional properties
• CPC Class Codes: B32B 27/16 specially treated, e.g. irradiated
• CPC Class Codes: B32B 27/281 comprising polyimides
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2203/095 Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/388 by the use of a metallic or inorganic thin film adhesion layer
• CPC Class Codes: Y10T 428/12569 Synthetic resin

Abstract

An adhesive-free flexible laminate formed from a polyimide film in which at least one surface has been plasma treated, a tie-coat layer formed on the surface of the plasma-treated polyimide film, a metal seed layer made of either copper or copper alloy and which is formed on the tie-coat layer, and a metal conductive layer made of either copper or copper alloy and which is formed on the metal seed layer, wherein the atomic percent of Cu inclusion in the tie-coat layer is 0.5 at % or less. Consequently, provided is a flexible laminate capable of effectively inhibiting the deterioration of the peel strength upon producing a flexible laminate (in particular a two-layer metalizing laminate).

Claims

1. An adhesive-free flexible laminate formed from a polyimide film in which at least one surface has been plasma treated, a tie-coat layer formed on the surface of the plasma-treated polyimide film, a metal seed layer made of either copper or copper alloy and which is formed on the tie-coat layer, and a metal conductor layer made of either copper or copper alloy and which is formed on the metal seed layer, wherein the atomic percent of Cu inclusion in the tie-coat layer is 0.5 at % or less.

2. The adhesive-free flexible laminate according to claim 1, wherein the atomic percent of Cu inclusion in the tie-coat layer is 0.3 at % or less.

3. The adhesive-free flexible laminate according to claim 1, wherein the atomic percent of Cu inclusion in the tie-coat layer is 0.1 at % or less.

4. The adhesive-free flexible laminate according to claim 3, wherein the tie-coat layer is made of one type among nickel, chromium, cobalt, nickel alloy, chromium alloy and cobalt alloy;

and nickel, chromium or cobalt is the main component and has the greatest abundance ratio in the tie-coat layer.

5. The adhesive-free flexible laminate according to claim 4, wherein the tie-coat layer is made of an alloy of nickel and chromium, and the main component is Ni.

6. A flexible electronic circuit board comprising the adhesive-free flexible laminate according to claim 1.

7. The adhesive-free flexible laminate according to claim 1, wherein the tie-coat layer is made of nickel, chromium, cobalt, nickel alloy, chromium alloy or cobalt alloy, and nickel, chromium or cobalt is the main component of the tie-coat layer and is of the greatest atomic ratio in the tie-coat layer.

8. The adhesive-free flexible laminate according to claim 1, wherein the tie-coat layer is made of an alloy including nickel and chromium, and wherein a main component of the tie-coat layer is Ni.