×

Flexible Laminate and Flexible Electronic Circuit Board Formed by using the same

  • US 20120012367A1
  • Filed: 12/22/2009
  • Published: 01/19/2012
  • Est. Priority Date: 12/26/2008
  • Status: Active Grant
First Claim
Patent Images

1. An adhesive-free flexible laminate formed from a polyimide film in which at least one surface has been plasma treated, a tie-coat layer formed on the surface of the plasma-treated polyimide film, a metal seed layer made of either copper or copper alloy and which is formed on the tie-coat layer, and a metal conductor layer made of either copper or copper alloy and which is formed on the metal seed layer, wherein the atomic percent of Cu inclusion in the tie-coat layer is 0.5 at % or less.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×