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MEMS Device Comprising a Hermetically Sealed Cavity and Devices Obtained Thereof

  • US 20120013020A1
  • Filed: 07/13/2011
  • Published: 01/19/2012
  • Est. Priority Date: 07/15/2010
  • Status: Abandoned Application
First Claim
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1. A method for manufacturing a MEMS device comprising a hermetically sealed cavity containing a MEMS component, the method comprising:

  • providing a substrate having, on a major surface, a stack of a structural layer on a first dielectric layer;

    patterning the structural layer to form a MEMS component;

    forming a second dielectric layer overlying the MEMS component;

    forming a sealing dielectric layer overlying the second dielectric layer;

    forming, in the stack of dielectric layers, a trench enclosing the MEMS component thereby extending to the substrate;

    depositing a membrane layer overlying the sealing layer thereby filling the trench; and

    patterning the membrane layer thereby forming a membrane at the location of the cavity and an electrode covering the filled trench.

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