ELECTRONIC PACKAGE STRUCTURE

• US 20120014079A1
• Filed: 07/19/2011
• Published: 01/19/2012
• Est. Priority Date: 02/18/2008
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: CHEN, Da-Jung, WEN, Chau-Chun, LIU, Chun-Tiao
• Granted Patent: US 8,824,165 B2
• Time in Patent Office: Days
• US Class Current: 361/782
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10515 Stacked components
• CPC Class Codes: H05K 2201/10537 Attached components
• CPC Class Codes: H05K 2201/10924 Leads formed from a punched metal foil
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Claims

1. An electronic package, comprising:

an electronic element;

a lead frame having a plurality of leads, each of said leads having

a top end electrically coupled to said electronic element,

a bottom end, and

a middle section connecting said top end and said bottom end to define a bracket shape;

a coil bracketed by said leads;

a body encapsulating at least said coil, said body having a bottom face on which the bottom ends of the leads are positioned and exposed;

a first electrode electrically coupled to a first end of said coil;

a second electrode electrically coupled to a second end of said coil; and

wherein

a first bottom of said first electrode protrudes from the bottom face of said body;

a second bottom of said second electrode protrudes from the bottom face of said body; and

said bottom ends of the leads and the first and second bottoms of the first and second electrodes have undersides that are coplanar to define said package as a surface-mount package.

2. An electronic package as claimed in claim 1, wherein said middle section of at least one of the leads is exposed out of said body along a side face of said body.

3. An electronic package as claimed in claim 1, wherein said middle section of at least one of the leads is embedded in said body.

4. An electronic package as claimed in claim 1, wherein said body extends above said top ends of the leads and has a recess in which said electronic element is positioned.

5. An electronic package as claimed in claim 4, wherein

said top ends have portions extending into and being exposed within said recess;

and

said electronic element is electrically coupled to said exposed portions of the top ends.

6. An electronic package as claimed in claim 4, further comprising:

a circuit board positioned within said recess, above the top ends of the leads and below the electronic element;

wherein said circuit board is electrically coupled between the top ends of the leads and the electronic element.

7. An electronic package as claimed in claim 4, further comprising:

an insulating encapsulant filled in said recess.

8. An electronic package as claimed in claim 4, wherein

a width of said recess is smaller than an outer dimension of said coil.

9. An electronic package as claimed in claim 8, wherein

the width of said recess is greater than an inner dimension of said coil.

10. An electronic package as claimed in claim 1, wherein the top end and bottom end of each said lead are positioned in parallel planes and the middle section of said lead is perpendicular to the top end and the bottom end.

11. An electronic package as claimed in claim 1, wherein said electronic element is one selected from the group consisting of a capacitor, a resistor, and an inductor with a smaller inductance than the coil.

12. An electronic package as claimed in claim 1 wherein said electronic element is one selected from the group consisting of a metal-oxide-semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), and a diode.

13. An electronic package as claimed in claim 1, wherein the coil is completely positioned within a space bordered by the top ends, the bottom ends and the middle sections of said leads.