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ELECTRONIC PACKAGE STRUCTURE

  • US 20120014079A1
  • Filed: 07/19/2011
  • Published: 01/19/2012
  • Est. Priority Date: 02/18/2008
  • Status: Active Grant
First Claim
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1. An electronic package, comprising:

  • an electronic element;

    a lead frame having a plurality of leads, each of said leads havinga top end electrically coupled to said electronic element,a bottom end, anda middle section connecting said top end and said bottom end to define a bracket shape;

    a coil bracketed by said leads;

    a body encapsulating at least said coil, said body having a bottom face on which the bottom ends of the leads are positioned and exposed;

    a first electrode electrically coupled to a first end of said coil;

    a second electrode electrically coupled to a second end of said coil; and

    whereina first bottom of said first electrode protrudes from the bottom face of said body;

    a second bottom of said second electrode protrudes from the bottom face of said body; and

    said bottom ends of the leads and the first and second bottoms of the first and second electrodes have undersides that are coplanar to define said package as a surface-mount package.

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