METHOD FOR MATERIAL PROCESSING AND LASER PROCESSING DEVICE FOR MATERIAL PROCESSING

• US 20120015318A1
• Filed: 07/19/2011
• Published: 01/19/2012
• Est. Priority Date: 01/20/2009
• Status: Abandoned Application

• Current Assignee: Anton Kasenbacher, Lumera Laser GmbH (Coherent Corp.)
• Original Assignee: Anton Kasenbacher, Lumera Laser GmbH (Coherent Corp.)
• Inventors: KASENBACHER, Anton
• Application Number:
  US13/185,835
• Publication Number:
  US 20120015318A1
• Time in Patent Office: Days
• US Class Current: 433/29
• CPC Class Codes: A61C 1/0046 Dental lasers surgical lasers A61B18/20; working by laser beam in general B23K26/00; lasers per se H01S3/00
• CPC Class Codes: B23K 2103/32 Material from living organisms, e.g. skins
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/04 Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
• CPC Class Codes: B23K 26/043 along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
• CPC Class Codes: B23K 26/0732 into a rectangular shape

Abstract

A method for material processing and laser processing device for material processing. The laser machining device has a laser beam source to provide a pulsed processing laser beam, a laser beam aligning unit to output couple the laser beam in the direction toward a area of material to be machined, and an emission device to emit a photosensitizer in the direction toward a surrounding area of the area of the material to be machined, wherein the emission device is connected to the aligning unit.

Claims

1. A method for ablating a material excluding tissue, mercury and amalgam fillings, the method comprising:

in a processing mode, providing a pulsed processing laser beam;

bringing a photosensitizer into an area surrounding a region of a material that is to be ablated; and

irradiating the region of the material that is to be ablated with the pulsed processing laser beam.

2. A method as claimed in claim 1, wherein

electromagnetic radiation emitted from surroundings of the ablated region is detected, and

the pulsed processing laser beam is set depending on the detected electromagnetic radiation.

3. A method as claimed in claim 1, wherein

the pulsed laser beam is set such that at least one of the following conditions is met:

the temperature of plasma generated by the processing laser beam is no more than 11604.5 K, which corresponds to 1 eV, the mean oscillation energy of the electrons in the alternating electromagnetic field of the processing laser beam is below 0.021 eV.

4. The method as claimed in claim 2, wherein

the pulsed processing laser beam is initially set on the basis of calculations such that at least one of the conditions is satisfied, and

the processing laser beam is set, during the running processing operation, depending on the detected electromagnetic radiation.

5. The method as claimed in claim 1, wherein

the photosensitizer and the wavelength of the laser beam are selected in such a way that the processing laser beam is absorbed at least partially in the photosensitizer by a single photon absorption, the absorption being in the vicinity of an absorption maximum of the photosensitizer.

6. The method as claimed in claim 1, wherein the photosensitizer and the wavelength of the laser beam are selected in such a way that the processing laser beam is absorbed at least partially in the photosensitizer by an N photon absorption, with N≧

2, the absorption being in the vicinity of an absorption maximum of the photosensitizer.

7. The method as claimed in claim 1, wherein a repetition rate of the laser pulses is set in a range between 1 Hz and 10 MHz.

8. The method as claimed in claim 1, wherein the processing laser beam has a substantially rectangular beam profile.

9. The method as claimed in claim 1, wherein the region to be ablated is scanned by the processing laser beam.

10. The method as claimed in claim 9, wherein exactly one laser pulse is applied to a subregion covered by the focus of the processing laser beam.

11. The method as claimed in claim 10, wherein mutually adjacent sub regions covered by one laser pulse in each case have a spatial overlap with one another whose surface area is smaller than half the surface area of a subregion.

12. The method as claimed in claim 1, wherein control is carried out so that the spatial position of the focus remains on the surface of the region during ablating.

13. The method as claimed in claim 1, wherein the region to be ablated is determined in a diagnostic mode.

14. The method as claimed in claim 13, wherein the region to be ablated is determined by applying to the material a marker that, when in contact with a specific material type assumes a characteristic coloration or exhibits another detectable response, in particular on the basis of an external excitation.

15. The method as claimed in claim 14, wherein the marker is a photosensitizer and identical to the photosensitizer used in the processing mode.

16. The method as claimed in claim 13, wherein the region to be processed is determined by detecting the presence of a signal generated in the material or in a marker located in an area surrounding the material, and the signal strength of which is detected, if appropriate.

17. The method as claimed in claim 16, wherein the signal is a fluorescence radiation or a second or a higher harmonic of an electromagnetic radiation irradiated onto the material or the marker.

18. The method as claimed in claim 17, wherein the electromagnetic radiation is that of a diagnostic laser beam that has an energy density on the surface of the material or of the photosensitizer or marker which is smaller than the energy density that is required to process the material.

19. The method as claimed in claim 18, wherein the processing laser beam and the diagnostic laser beam are produced by one and the same laser radiation source.

20. The method as claimed in claim 17, wherein the electromagnetic radiation is that of an incoherent light source.

36. The laser ablation device as claimed in claim 21, wherein the laser beam aligning unit is designed as a handpiece wherein, in conjunction with the method of claim 20, the output device to output the photosensitizer is included at least in part.

37. The laser ablation device as claimed in claim 36, wherein the scanning unit and/or the autofocus unit are/is included in the handpiece.

21. A laser ablation device for ablating a material, comprising:

a laser radiation source to provide a pulsed processing laser beam;

a laser beam aligning unit to decouple the laser beam in the direction of a region of the material to be ablated; and

an output device to output a photosensitizer in the direction of an area surrounding the region of the material that is to be ablated, the output device being connected to the laser beam aligning unit.

22. The laser ablation device as claimed in claim 21, comprising:

a detector to detect electromagnetic radiation emitted by an area surrounding the region that is to be ablated.

23. The laser ablation device as claimed in claim 21, wherein the laser pulses have a temporal full-width at half maximum in a range between 100 fs and 1 ns.

24. The laser ablation device as claimed in claim 21, wherein a repetition rate of the laser pulses can be set in a range between 1 Hz and 10 MHz.

25. The laser ablation device as claimed in claim 21, wherein the wavelength of the laser pulses and the material of the photosensitizer are selected in such a way that the processing laser beam is absorbed at least partially by a single photon absorption in the photosensitizer, the absorption being in the vicinity of an absorption maximum of the photosensitizer.

26. The laser ablation device as claimed in claim 21, wherein the wavelength of the laser pulses and the material of the photosensitizer are selected in such a way that the processing laser beam is absorbed at least partially in the photosensitizer by an N photon absorption, with N≧

2, the absorption being in the vicinity of an absorption maximum of the photosensitizer.

27. The laser ablation device as claimed in claim 21, further comprising:

a fixer connected to the laser beam aligning unit to spatially fix a distal end of the laser beam aligning unit with reference to a section of the material to be ablated.

28. The laser ablation device as claimed in claim 21, further comprising:

a beam shaping unit to shape a substantially rectangular beam profile of the pulsed processing laser beam.

29. The laser ablation device as claimed in claim 21, further comprising:

a scanning unit to scan a region of the tissue with the processing laser beam.

30. The laser ablation device as claimed in claim 29, wherein the scanning unit is designed in such a way that exactly one laser pulse is applied to a subregion covered by the focus of the processing laser beam.

31. The laser ablation device as claimed in claim 29, wherein the scanning unit is designed in such a way that mutually adjacent sub regions covered by one laser pulse in each case have a spatial overlap with one another whose surface area is smaller than half a subregion.

32. The laser ablation device as claimed in claim 31, further comprising:

an autofocus unit to keep constant the spatial position of the focus on the surface of the tissue.

33. The laser ablation device as claimed in claim 31, further comprising:

a detection unit to detect the presence of a signal generated in the tissue or in an area surrounding it, and the strength of said signal, if appropriate.

34. The laser ablation device as claimed in claim 33, wherein the detection unit has an optical sensor.

35. The laser ablation device as claimed in claim 34, wherein the optical sensor is designed to detect a fluorescence radiation or a second harmonic or a higher harmonic of an electromagnetic radiation irradiated onto the tissue or the marker or the photosensitizer.

38. The laser ablation device as claimed in claim 21, wherein the laser radiation source includes a laser oscillator, and the laser pulses generated by the laser oscillator can be fed to the aligning unit without further optical amplification.

39. The laser ablation device as claimed in claims 21, further comprising:

a plurality of nozzles which are or can be aligned in the direction of the region to be processed of the material or in the direction of another region.

40. The laser ablation device as claimed in claim 39, further comprising:

a photosensitizer nozzle to apply a photosensitizer onto the region to be processed, and optionally

a radiation protection nozzle to apply a radiation protection medium, onto a region outside of the region to be processed, and optionally

a coolant nozzle to apply a coolant onto the region to be processed and/or a region outside of the region to be processed.