VIBRATION ISOLATION TARGET MOUNTING STRUCTURE AND METHOD

• US 20120018611A1
• Filed: 07/20/2011
• Published: 01/26/2012
• Est. Priority Date: 07/23/2010
• Status: Abandoned Application

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Ishii, Itaru, Ohta, Tameharu, Shinoda, Takeshi, Nakano, Keisuke
• Application Number:
  US13/186,506
• Publication Number:
  US 20120018611A1
• Time in Patent Office: Days
• US Class Current: 248/636
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: G01C 19/5769 Manufacturing; Mounting; Housings
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A bonding structure of a vibration isolation target is disclosed. The structure includes: a base; a vibration isolation target mounted to the base; and a vibration isolator bonds together the base and the vibration isolation target. A lift-up portion is formed on one of the base and the vibration isolation target, and is lift-upped from the one toward the other of the base and the vibration isolation target. The lift-up portion has an apex surface located at an apex of the lift-up portion. The vibration isolator is on the apex surface.

Claims

1. A bonding structure comprising:

a base;

a vibration isolation target that is mounted to the base and is a target for vibration isolation; and

a vibration isolator that is arranged between and bonds together the base and the vibration isolation target, and damps a relative vibration between the base and the vibration isolation target,

wherein;

the base and the vibration isolation target have, respectively, a first opposed surface and a second opposed surface that are opposed to each other;

a lift-up portion is formed on at least one of the first opposed surface and the second opposed surface, and is lift-upped from the one toward the other of the first opposed surface and the second opposed surface;

the lift-up portion has

an apex surface located at an apex of the lift-up portion,

a side surface surrounding the apex surface, and

a corner formed by the apex surface and the side surface so that the corner surrounds the apex surface; and

the vibration isolator bonds

only the apex surface, out of one of the first opposed surface and the second opposed surface,

to the other of the first opposed surface and the second opposed surface.

2. The bonding structure according to claim 1, wherein:

the lift-up portion is formed as a first lift-up portion on the first opposed surface of the base and a second lift-up portion on the second opposed surface of the vibration isolation target; and

the apex surface of the first lift-up portion and the apex surface of the second lift-up portion have a same shape and a same size, and are arranged opposed each other.

3. The bonding structure according to claim 1, wherein:

shape of the apex surface is a true circle.

4. The bonding structure according to claim 1, wherein:

the vibration isolation target includes a sensor chip having a detection part for detecting physical quantity.

5. The bonding structure according to claim 4, wherein:

the detection part has an oscillator to detect angular velocity.

6. The bonding structure according to claim 4, wherein:

the vibration isolation target further includes

a package that has a box shape, has an opening on one surface of the package, and receives therein the sensor chip, and

a lid that covers the opening; and

the base is a case for receiving the vibration isolation target.

7. The bonding structure according to claim 6, wherein:

the case is a resin molded body; and

the lift-up portion is integrated with the case.

8. The bonding structure according to claim 6, wherein:

the lid is made of metal; and

the lift-up portion is integrated with the lid.

9. The bonding structure according to claim 1, wherein:

one of the base and the vibration isolation target, the one having the lift-up portion, has an annular groove that adjoins and surrounds the lift-up portion.

10. The bonding structure according to claim 1, wherein:

the vibration isolator is made of elastomer.

11. A method for forming a bonding structure of claim 1, the method comprising:

placing the vibration isolator in a liquid form or in a semi-cured state on one of the base and the vibration isolation target so that the vibration isolator is placed on the apex surface of the lift-up portion or a opposed portion that is opposed to the apex surface;

positioning and placing the other of the base and the vibration isolation target relative to the one, on which the vibration isolator is placed, of the base and the vibration isolation target, so that the apex surface of the lift-up portion or the opposed portion contacts the vibration isolator; and

curing the vibration isolator after positioning and placing the other of the base and the vibration isolation target.

12. The method according to claim 11, wherein:

placing the vibration isolator includes

placing the vibration isolator on the apex surface of the lift-up portion of the one of the base and the vibration isolation target.