INTEGRATED LIGHTING APPARATUS AND METHOD OF MANUFACTURING THE SAME

• US 20120018745A1
• Filed: 07/20/2011
• Published: 01/26/2012
• Est. Priority Date: 07/20/2010
• Status: Active Grant

• Current Assignee: Epistar Corporation (Ennostar, Inc.)
• Original Assignee: Epistar Corporation (Ennostar, Inc.)
• Inventors: LIU, HSIN-MAO, HSIEH, MIN-HSUN, CHEN, TZER-PERNG, HONG, MENG-YUAN, HAN, CHENG NAN, LEE, TSUNG-XIAN, HSU, TA-CHENG, LU, CHIH-CHIANG
• Granted Patent: US 8,816,508 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An integrated lighting apparatus includes at least a lighting device, a control device comprising an integrated circuit, and a connector that is used to electrically connect the lighting device and the control device. With the combination, the integrated circuit drives the lighting device in accordance with its various designed functionality, thus expands applications of the integrated lighting apparatus.

Claims

1. An integrated lighting apparatus, comprising:

a control device including a semiconductor substrate;

an integrated circuit block formed on the semiconductor substrate;

a plurality of power pads formed on the integrated circuit block;

a light emitting device including an active layer, a first electrode, and a second electrode; and

a connector including a first conductive region and a second conductive region, wherein the first electrode is electrically connected to the control device through the first conductive region, and the second electrode is electrically connected to the control device through the second conductive region.

2. The integrated lighting apparatus of claim 1, wherein the semiconductor substrate comprises an extension part.

3. The integrated lighting apparatus of claim 1, further comprising a second control device.

4. The integrated lighting apparatus of claim 1, further comprising a second light emitting device.

5. The integrated lighting apparatus of claim 1, wherein the control device comprises at least one through plug and at least one connection pad.

6. The integrated lighting apparatus of claim 5, wherein the through plug comprises an isolation layer.

7. The integrated lighting apparatus of claim 1, wherein the light emitting device comprises a reflector.

8. The integrated lighting apparatus of claim 1, wherein the connector comprises a bridge circuit.

9. An integrated lighting apparatus, comprising:

a wafer;

a plurality of control devices formed on the wafer, wherein the control device includes a semiconductor substrate, an integrated circuit block formed on the semiconductor substrate, and a plurality of power pads formed on the integrated circuit block;

a carrier;

a plurality of light emitting devices formed on the carrier, wherein the light emitting device including an active layer, a first electrode, and a second electrode; and

a plurality of connectors formed on the control device, wherein the connector including a first conductive region and a second conductive region, wherein the first electrode is electrically connected to the control device through the first conductive region, and the second electrode is electrically connected to the control device through the second conductive region.