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MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PACKAGES, AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES

  • US 20120018887A1
  • Filed: 10/03/2011
  • Published: 01/26/2012
  • Est. Priority Date: 08/26/2005
  • Status: Active Grant
First Claim
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1. A microelectronic package, comprising:

  • a first substrate;

    a first microelectronic die electrically connecting with the first substrate;

    a second substrate electrically connecting with the first substrate; and

    a second microelectronic die electrically connecting to the second substrate.

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