SURFACE-MOUNTED SHIELDED MULTICOMPONENT ASSEMBLY
First Claim
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1. A surface-mounted shielded multicomponent assembly, comprising:
- a substrate;
a conductive contact on the substrate;
plural electronic components assembled on the substrate;
a conformal insulating layer on the electronic components and having a thickness smaller than a height of the electronic components, the conformal insulating layer including an opening emerging on the conductive contact;
a conductive shielding layer covering the insulating layer and extending in said opening; and
a resin layer covering the conductive layer.
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Abstract
A surface-mounted shielded multicomponent assembly, comprising a wafer on which several electronic components are assembled; an insulating layer conformally deposited on the structure with a thickness smaller than the height of the electronic components, comprising at least one opening emerging on a contact of said wafer; a conductive shielding layer covering the insulating layer and said at least one opening; and a resin layer covering the conductive layer.
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Citations
19 Claims
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1. A surface-mounted shielded multicomponent assembly, comprising:
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a substrate; a conductive contact on the substrate; plural electronic components assembled on the substrate; a conformal insulating layer on the electronic components and having a thickness smaller than a height of the electronic components, the conformal insulating layer including an opening emerging on the conductive contact; a conductive shielding layer covering the insulating layer and extending in said opening; and a resin layer covering the conductive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for forming a shielded multicomponent assembly, comprising:
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mounting first and second electronic components mounted on a substrate; conformally depositing an insulating layer on the first and second electronic components; forming a first opening through the insulating layer; conformally applying a conductive shielding layer on the deposited insulating layer and in the first opening; and covering the conductive shielding layer with a resin layer. - View Dependent Claims (9, 10, 11, 12)
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13. A surface-mounted shielded multicomponent assembly, comprising:
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a substrate; plural electronic components assembled on the substrate; a conformal insulating layer on the electronic components and having a thickness smaller than a height of the electronic components; a conformal, conductive shielding layer covering the insulating layer; and a resin layer covering the conductive layer. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification