SURFACE-MOUNTED SHIELDED MULTICOMPONENT ASSEMBLY

• US 20120020039A1
• Filed: 06/17/2011
• Published: 01/26/2012
• Est. Priority Date: 12/19/2008
• Status: Abandoned Application

• Current Assignee: STMicroelectronics SAS (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SAS (STMicroelectronics NV)
• Inventors: Coffy, Romain, Sauty, Jean-François
• Application Number:
  US13/163,533
• Publication Number:
  US 20120020039A1
• Time in Patent Office: Days
• US Class Current: 361/760
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01058 Cerium [Ce]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 : by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 2201/0179 : Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
• CPC Class Codes: H05K 2201/09872 : Insulating conformal coating
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/388 : by the use of a metallic or inorganic thin film adhesion layer
• CPC Class Codes: H05K 9/0022 : of components mounted on printed circuit boards [PCB] shields integrated within component packages H01L23/552; shields integrated within PCB H05K1/0218
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A surface-mounted shielded multicomponent assembly, comprising a wafer on which several electronic components are assembled; an insulating layer conformally deposited on the structure with a thickness smaller than the height of the electronic components, comprising at least one opening emerging on a contact of said wafer; a conductive shielding layer covering the insulating layer and said at least one opening; and a resin layer covering the conductive layer.

Claims

1. A surface-mounted shielded multicomponent assembly, comprising:

a substrate;

a conductive contact on the substrate;

plural electronic components assembled on the substrate;

a conformal insulating layer on the electronic components and having a thickness smaller than a height of the electronic components, the conformal insulating layer including an opening emerging on the conductive contact;

a conductive shielding layer covering the insulating layer and extending in said opening; and

a resin layer covering the conductive layer.

2. The assembly of claim 1, wherein the conductive shielding layer is provided with grooves.

3. The assembly of claim 1, wherein the conductive shielding layer comprises at least two metal layers, respectively made of titanium-tungsten and of copper.

4. The assembly of claim 1, wherein the insulating layer is made of a carbon polymer.

5. The assembly of claim 1, wherein said substrate is a printed circuit board portion having a lower surface side, an upper surface side, a contact pad on the upper surface side and coupled with at least one of the components, a contact ball on the lower surface side, and a conductive connection between the contact pad and the contact ball.

6. The assembly of claim 1, wherein said substrate is a printed circuit board portion having a lower surface side, an upper surface side on which the conductive contact is positioned, a contact ball on the lower surface side, and a conductive connection between the conductive contact and the contact ball.

7. The assembly of claim 1 wherein the electronic components include first and second electronic components spaced apart from each other by a gap and the insulating layer and shielding layer both extend in the gap between the first and second electronic components.

8. A method for forming a shielded multicomponent assembly, comprising:

mounting first and second electronic components mounted on a substrate;

conformally depositing an insulating layer on the first and second electronic components;

forming a first opening through the insulating layer;

conformally applying a conductive shielding layer on the deposited insulating layer and in the first opening; and

covering the conductive shielding layer with a resin layer.

9. The method of claim 8, further comprising cutting grooves into the conductive shielding layer prior to covering the conductive shielding layer with the resin layer.

10. The method of claim 8, further comprising:

mounting third and fourth electronic components on the substrate, wherein the depositing includes conformally depositing the insulating layer on the third and fourth electronic components;

forming a second opening through the insulating layer, wherein the applying includes applying the conductive shielding layer on the deposited insulating layer and in the second opening and the covering includes covering the shielding layer and the third and fourth electronic components with the resin layer; and

forming a plurality of individual shielded electronic assemblies by cutting though the substrate and the insulating, shielding, and resin layers.

11. The method of claim 8, wherein the conductive shielding layer comprises first and second metal layers.

12. The method of claim 11, wherein the applying includes spraying the first metal layer on the insulating layer and in the opening and electrodepositing the second metal layer on the first metal layer.

13. A surface-mounted shielded multicomponent assembly, comprising:

a substrate;

plural electronic components assembled on the substrate;

a conformal insulating layer on the electronic components and having a thickness smaller than a height of the electronic components;

a conformal, conductive shielding layer covering the insulating layer; and

a resin layer covering the conductive layer.

14. The assembly of claim 13, wherein the conductive shielding layer includes grooves and the resin layer extends within the grooves.

15. The assembly of claim 13, wherein the conductive shielding layer comprises at least two metal layers.

16. The assembly of claim 13, wherein the insulating layer is made of a carbon polymer.

17. The assembly of claim 13, wherein said substrate is a printed circuit board portion having a lower surface side, an upper surface side, a contact pad on the upper surface side and coupled with at least one of the components, a contact ball on the lower surface side, and a conductive connection between the contact pad and the contact ball.

18. The assembly of claim 13, wherein said substrate is a printed circuit board portion having a lower surface side, an upper surface side, a conductive contact coupled to the conductive shielding layer, a contact ball on the lower surface side, and a conductive connection between the conductive contact and the contact ball.

19. The assembly of claim 13 wherein the electronic components include first and second electronic components spaced apart from each other by a gap and the insulating layer and shielding layer both extend in the gap between the first and second electronic components.