PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

• US 20120024574A1
• Filed: 07/21/2011
• Published: 02/02/2012
• Est. Priority Date: 07/30/2010
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: INOUE, Shinichi, HANAZONO, Hiroyuki, HASEGAWA, Mineyoshi
• Granted Patent: US 8,822,834 B2
• Time in Patent Office: Days
• US Class Current: 174/250
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0116 Porous, e.g. foam
• CPC Class Codes: H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A printed circuit board includes a base insulating layer formed of a porous film. Conductor traces are formed on the base insulating layer formed of the porous film. A cover insulating layer is formed on the base insulating layer to cover the conductor traces. The porous film used as the base insulating layer has a reflectivity of not less than 50% for light of at least a part of wavelengths in a wavelength region from 400 nm to 800 nm.

Claims

1. A printed circuit board comprising:

an insulating layer formed of a porous film; and

a conductor trace formed on said insulating layer, wherein

said porous film has a reflectivity of not less than 50% for light of at least a part of wavelengths in a wavelength region of not less than 400 nm and not more than 800 nm.

2. The printed circuit board according to claim 1, wherein said porous film has an average pore size of not less than 0.001 μ

m and not more than 10 μ

m.

3. The printed circuit board according to claim 1, further comprising an element that receives or emits light, wherein

said element is mounted on said insulating layer to be electrically connected to said conductor trace.

4. The printed circuit board according to claim 1, wherein said porous film has a reflectivity of not less than 50% for a wavelength of light of at least any of red, green and blue.

5. The printed circuit board according to claim 1, wherein said porous film has reflectivities of not less than 50% for wavelengths of light of red, green and blue.

6. The printed circuit board according to claim 1, wherein said porous film has reflectivities of not less than 80% for wavelengths of light of red, green and blue.

7. A method of manufacturing a printed circuit board comprising the steps of:

preparing an insulating layer formed of a porous film having a reflectivity of not less than 50% for light of at least a part of wavelengths in a wavelength region of not less than 400 nm and not more than 800 nm; and

forming a conductor trace on said insulating layer.

8. The method of manufacturing the printed circuit board according to claim 7, further comprising the step of mounting an element that receives or emits light on said insulating layer such that the element is electrically connected to said conductor trace.