PHOSPHOR SUSPENDED IN SILICONE, MOLDED/FORMED AND USED IN A REMOTE PHOSPHOR CONFIGURATION

• US 20120025216A1
• Filed: 07/21/2011
• Published: 02/02/2012
• Est. Priority Date: 07/28/2010
• Status: Active Grant

• Current Assignee: Consumer Lighting, LLC (d/b/a GE Lighting) (Savant Systems, LLC)
• Original Assignee: GE Lighting Solutions LLC (Savant Systems, LLC)
• Inventors: Kolodin, Boris, Deshpande, Anirudha R.
• Granted Patent: US 8,835,199 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: C09K 11/02 Use of particular materials as binders, particle coatings or suspension media therefor
• CPC Class Codes: C09K 11/08 containing inorganic luminescent materials
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

A light emitting package comprising a support hosting at least one light emitting diode. A light transmissive dome comprised of a silicone including a phosphor material positioned to receive light emitted by the diode. A glass cap overlies said dome

Claims

1. A method for manufacturing a light emitting package, the method comprising:

securing at least one light emitting chip to a hoard;

premixing two or more parts of silicone with phosphor material forming a feedstock;

shaping said feedstock in a mold to form a silicone shell;

post-processing said silicone shell with phosphors suspended therein; and

disposing said shell over said light emitting chip.

2. The method of claim 1 further comprising securing a glass dome to said silicone shell.

3. The method of claim 2 herein said securing step comprises application of a thermally conductive adhesive.

4. The method of claim 1 wherein said post-processing comprises thermal cross-linking.

5. A lighting package comprising:

at least one light emitting chip;

aboard supporting said at least one light emitting chip; and

a light transmissive silicone shell including a phosphor material disposed therein,

wherein said light transmissive silicone shell is positioned to receive light emitted by said chip.

6. The lighting package of claim 5 comprising at least two light emitting chips.

7. The light emitting package of claim 5 wherein said shell includes a diameter of greater than about 20 mm.

8. The light emitting package of claim 5 wherein said phosphor material comprises a mixture of different phosphors emitting to create a white light blend.

9. The light emitting package of claim 5 further comprising a glass component in thermal communication with said silicone shell.

10. The light emitting package of claim 5 wherein said silicone comprises a transparent methyl based silicone having ashore A hardness between about 41 and 46, a refractive index greater than about 1.3 and a tensile strength greater than about 5.5 MPa.

11. A light emitting package comprising a support hosting at least one light emitting diode, a light transmissive dome comprised of a silicone including a phosphor material, said dome positioned to receive a light emitted by said diode and a glass cap in thermal communication with said dome.

12. The light emitting package of claim 11 wherein saide do and said cap are concentrically shaped.

13. The light emitting package of claim 11 further comprising an adhesive securing said cap to said dome.

14. The light emitting device of claim 11 wherein said adhesive has a thermal conductivity of at least 1 watt/meter/°

K.

15. The light emitting package of claim 11 wherein said dome includes a thermally conductive filler.

16. The light emitting package of claim 15 wherein said filler is selected from Al₂O₃, ITO, AlN and mixtures thereof

17. The light emitting package of claim 15 wherein said filler has an average particle size of about 10 nm.

18. The light emitting package of claim 11 comprising at least two light emitting diodes.

19. The light emitting package of claim 11 wherein said dome has a diameter less than about 20 mm.

20. A light emitting package comprised of at least one light emitting diode, a silicone sheet receiving light emitting by said light diode, said sheet including a dispersed phosphor material, and a glass component in thermal communication with said sheet.

21. The light emitting package of claim 20 wherein said glass component comprises a glass dome.