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SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD

  • US 20120025218A1
  • Filed: 08/02/2011
  • Published: 02/02/2012
  • Est. Priority Date: 08/02/2010
  • Status: Active Grant
First Claim
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1. A semiconductor light-emitting device comprising:

  • a base board having a mounting surface and a conductor pattern formed on the mounting surface;

    a semiconductor light-emitting chip having a bottom surface, a top surface and a side surface, and including chip electrodes adjacent the bottom surface, each of the chip electrodes electrically connected to a respective portion of the conductor pattern of the base board via solder bumps;

    a transparent plate having a side surface and a bottom surface formed in a substantially planar shape, and located over the top surface of the semiconductor light-emitting chip so that the bottom surface of the transparent plate covers the top surface of the semiconductor light-emitting chip; and

    a wavelength converting layer having a thickness and a side surface disposed between the bottom surface of the transparent plate and at least the side surface of the semiconductor light-emitting chip so that the side surface of the wavelength converting layer extends from the side surface of the semiconductor light-emitting chip toward the bottom surface of the transparent plate, the wavelength converting layer including at least one phosphor having a particle size and a particulate spacer having a particle size that is larger than the particle size of the at least one phosphor, wherein the thickness of the wavelength converting layer is defined between the top surface of the semiconductor light-emitting chip and the bottom surface of the transparent plate and is maintained by supporting the bottom surface of the transparent plate using the particulate spacer located on the top surface of the semiconductor light-emitting chip.

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