PACKAGE OF LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

• US 20120025240A1
• Filed: 01/28/2011
• Published: 02/02/2012
• Est. Priority Date: 07/27/2010
• Status: Abandoned Application

• Current Assignee: Advanced Optoelectronic Technology, Inc.
• Original Assignee: Advanced Optoelectronic Technology, Inc.
• Inventors: LIN, SHEN-BO
• Application Number:
  US13/015,592
• Publication Number:
  US 20120025240A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A method of manufacturing a package of light emitting device includes the following steps: providing a light emitting element and positioning the light emitting element at a bottom of a reflecting cup; providing phosphors and a compound of epoxy resin and silicone, and mixing the phosphors and the compound of epoxy resin and silicone to obtain a mixture by a process of kneading; and encapsulating the light emitting element with the mixture to form an encapsulant received in the reflecting cup.

Claims

1. A package of light emitting device comprising:

a reflecting cup;

at least two electrodes;

a light emitting element positioned in a bottom of the reflecting cup and electrically connected to the electrodes; and

an encapsulant received in the reflecting cup and encapsulating the light emitting element, the encapsulant comprising a compound of epoxy resin and silicone, and phosphors scattered in the compound.

2. The package of light emitting device of claim 1, wherein the reflecting cup is a mixture which includes titanium dioxide (TiO₂), hardener, and a compound of epoxy resin and silicone, and the titanium dioxide.

3. The package of light emitting device of claim 1, wherein the light emitting element is mounted on a base, the base being a mixture which includes titanium dioxide, hardener, and a compound of epoxy resin and silicone.

4. The package of light emitting device of claim 3, wherein the reflecting cup is integrally formed with the base as a single piece.

5. The package of light emitting device of claim 1, wherein the light emitting element is a light emitting diode.

6. A method of manufacturing a package of light emitting device comprising:

providing a light emitting element and a reflecting cup, positioning the light emitting element in a bottom of the reflecting cup;

providing phosphors and a compound of epoxy resin and silicone, and mixing the phosphors and the compound of epoxy resin and silicone to obtain a mixture by a process of kneading; and

encapsulating the light emitting element with the mixture to form an encapsulant received in the reflecting cup.

7. The method of claim 6, wherein the encapsulant is formed by a process of transfer molding.

8. The method of claim 6, wherein the reflecting cup is formed on a base, and the light emitting element is mounted on a top of the base.

9. The method of claim 8, wherein the base is integrally formed with the reflecting cup as a single piece, and is made of a mixture which includes titanium dioxide (TiO2), hardener, and a compound of epoxy resin and silicone, and the titanium dioxide, the hardener and the compound of epoxy resin and silicone being mixed by a process of kneading.

10. The method of claim 9, wherein the base and the reflecting cup are formed by a process of transfer molding or embedded shaping.

11. The method of claim 6, wherein the light emitting element is a light emitting diode.

12. The method of claim 8, wherein the light emitting element electrically connects to two electrodes formed with the base.