COMPONENT FOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE AND PRODUCING METHOD THEREOF

• US 20120025247A1
• Filed: 07/13/2011
• Published: 02/02/2012
• Est. Priority Date: 07/27/2010
• Status: Abandoned Application

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: OOYABU, Yasunari, NAKAMURA, Toshitaka, FUJII, Hironaka, ITO, Hisataka
• Application Number:
  US13/182,064
• Publication Number:
  US 20120025247A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A component for a light-emitting device includes a sealing resin layer that is capable of sealing in a light emitting diode, a fluorescent layer that is formed on one face of the sealing resin layer and is capable of emitting fluorescent light, and a reflection layer that is provided on the other face of the sealing resin layer so as to avoid a region where the sealing resin layer seals in the light emitting diode and is capable of reflecting the light.

Claims

1. A component for a light-emitting device comprising:

a sealing resin layer that is capable of sealing in a light emitting diode;

a fluorescent layer that is formed on one face of the sealing resin layer and is capable of emitting fluorescent light; and

a reflection layer that is provided on the other face of the sealing resin layer so as to avoid a region where the sealing resin layer seals in the light emitting diode and is capable of reflecting the light.

2. The component for a light-emitting device according to claim 1, wherein

the reflection layer is formed with a pattern on the entire region excluding the region where the sealing resin layer seals in the light emitting diode.

3. A light-emitting device comprising:

a component for a light-emitting device comprising

a sealing resin layer that is capable of sealing in a light emitting diode;

a fluorescent layer that is formed on one face of the sealing resin layer and is capable of emitting fluorescent light; and

a reflection layer that is provided on the other face of the sealing resin layer so as to avoid a region where the sealing resin layer seals in the light emitting diode and is capable of reflecting the light.

4. The light-emitting device according to claim 3, comprising:

a circuit board to which external electric power is supplied;

a light emitting diode that is electrically connected onto the circuit board and emits light based on electric power from the circuit board;

a housing that is provided on the circuit board so as to surround the light emitting diode and so that the upper end portion thereof is positioned above the upper end portion of the light emitting diode; and

the component for a light-emitting device that is provided on the circuit board so that the sealing resin layer covers the light emitting diode and the fluorescent layer is disposed on the housing.

5. A method for producing a light-emitting device comprising the steps of:

electrically connecting a light emitting diode onto a circuit board to which external electric power is supplied;

providing a housing on the circuit board so as to surround the light emitting diode and so that the upper end portion thereof is positioned above the upper end portion of the light emitting diode;

providing a component for a light-emitting device including a sealing resin layer that is capable of sealing in a light emitting diode;

a fluorescent layer that is formed on one face of the sealing resin layer and is capable of emitting fluorescent light; and

a reflection layer that is provided on the other face of the sealing resin layer so as to avoid a region where the sealing resin layer seals in the light emitting diode and is capable of reflecting the light

on the circuit board so that the sealing resin layer covers the light emitting diode and the fluorescent layer is disposed on the housing.