ELECTRONICS SUBSTRATE WITH ENHANCED DIRECT BONDED METAL

• US 20120026692A1
• Filed: 07/26/2011
• Published: 02/02/2012
• Est. Priority Date: 07/28/2010
• Status: Abandoned Application

• Current Assignee: Wolverine Tube Incorporated
• Original Assignee: Wolverine Tube Incorporated
• Inventors: Smith, Donald Lynn, Loong, Sy-Jenq
• Application Number:
  US13/191,281
• Publication Number:
  US 20120026692A1
• Time in Patent Office: Days
• US Class Current: 361/702
• CPC Class Codes: B21J 5/068 Shaving, skiving or scarifying for forming lifted portions, e.g. slices or barbs, on the surface of the material
• CPC Class Codes: H01L 21/4878 Mechanical treatment, e.g. deforming
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 83/0341 Processes

Abstract

A substrate for electronic components includes a ceramic tile and a cooling metal layer. The cooling metal layer can include copper, aluminum, nickel, gold, or other metals. The cooling metal layer has an enhanced surface facing away from the ceramic tile, where the enhanced surface includes either fins or pins. Electronic components can be connected to the substrate on a surface opposite the cooling metal layer.

Claims

1. An electronics substrate comprising:

a ceramic tile having an electronics face opposite a cooling face;

a cooling metal layer directly bonded to the cooling face, where the cooling metal layer comprises a monolithic enhanced surface; and

an electronic metal layer directly bonded to the electronics face;

2. The substrate of claim 1 where the enhanced surface comprises a plurality of fins separated by channels.

3. The substrate of claim 2 where the cooling metal layer has a cooling metal layer outer surface, and the fins extend beyond the cooling metal layer outer surface.

4. The substrate of claim 1 where the enhanced surface comprises a plurality of pins.

5. The substrate of claim 4 where the cooling metal layer has a cooling metal layer outer surface, and the pins extend beyond the cooling metal layer outer surface.

6. The substrate of claim 1 where the ceramic tile consists of a material selected from aluminum oxide, aluminum nitride, beryllium oxide, or any combination thereof.

7. The substrate of claim 1 further comprising a tub connected to the cooling metal layer over the monolithic enhanced surface such that a chamber is formed between the tub and the cooling metal layer, and the enhanced surface is positioned within the chamber.

8. The substrate of claim 7 further comprising a coolant inlet and a coolant outlet penetrating the chamber.

9. The substrate of claim 1 further comprising an electronic component mounted to the electronic metal layer.

10. The substrate of claim 1 where the cooling metal layer has a thickness between 0.2 millimeters and 0.5 millimeters.

11. The substrate of claim 1 where the cooling metal layer comprises a plurality of monolithic enhanced surfaces.

12. A method of producing an electronics substrate comprising:

(a) providing a ceramic tile with a cooling metal layer and an electronic metal layer directly bonded to opposite sides of the ceramic tile, and where the cooling metal layer has a cooling metal layer thickness

(b) securing the substrate to a machining base;

(c) cutting fins into the cooling metal layer with a tool after step (a) to form an enhanced surface, where the tool cuts into the cooling metal layer to a depth less than the cooling metal layer thickness;

13. The method of claim 12 further comprising:

(d) connecting a tub to the cooling metal layer such that a chamber is formed between the tub and the cooling metal layer, and where enhanced surface is positioned in the chamber.

14. The method of claim 13 further comprising:

(e) forming a coolant inlet and a coolant outlet that penetrate the chamber;

15. The method of claim 12 further comprising:

connecting an electronic component to the electronic metal layer

16. The method of claim 12 where step (c) further comprises forming the fins to a fin height extending beyond a cooling metal layer outer surface.

17. The method of claim 12 further comprising slicing across the fins to form pins which extend beyond a cooling metal layer outer surface.

18. The method of claim 12 where the ceramic tile consists of aluminum oxide, aluminum nitride, beryllium oxide, or any combination thereof.

19. The method of claim 12 where the cooling metal layer thickness is between 0.2 and 0.5 millimeters.

20. An electronics substrate comprising:

an insulating material having an electronics face opposite a cooling face;

a cooling metal layer directly bonded to the cooling face, where the cooling metal layer comprises a monolithic enhanced surface;

an electronic metal layer directly bonded to the electronics face; and

means for passing a coolant directly over the enhanced surface while protecting the electronic metal layer from direct contact with the coolant.

21. The electronics substrate of claim 20 where the insulating material is a ceramic tile.