VITAL-SIGNS MONITOR WITH ENCAPSULATION ARRANGEMENT
First Claim
Patent Images
1. A vital-signs monitor patch comprising:
- at least one sensor configured to measure a physiological parameter of a patient;
a circuit assembly containing vital-signs monitoring circuitry that analyzes the sensor measurements to generate vital sign signals; and
a housing that encapsulates the circuit assembly, configured for wearing by a patient, wherein the housing encapsulates the circuit assembly such that moisture and particulate matter is prevented from reaching the circuit assembly through the housing.
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Abstract
A vital-signs monitoring device is disclosed. The vital-signs monitor includes a sensor that measures a physiological parameter of a patient, a circuit assembly containing vital-signs monitoring circuitry that analyzes the sensor measurements to generate vital sign signals, and a housing. The housing is designed to be worn by a patient and encapsulates the circuit assembly such that moisture and particulate matter is prevented from reaching the circuit assembly through the housing.
161 Citations
20 Claims
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1. A vital-signs monitor patch comprising:
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at least one sensor configured to measure a physiological parameter of a patient; a circuit assembly containing vital-signs monitoring circuitry that analyzes the sensor measurements to generate vital sign signals; and a housing that encapsulates the circuit assembly, configured for wearing by a patient, wherein the housing encapsulates the circuit assembly such that moisture and particulate matter is prevented from reaching the circuit assembly through the housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A vital-signs monitor patch comprising:
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at least one sensor configured to measure a physiological parameter of a patient; a circuit assembly containing vital-signs monitoring circuitry that analyzes the sensor measurements to generate vital sign signals; and a housing configured for wearing by a patient and encapsulating the circuit assembly, the housing comprising a first layer and a second layer opposing the first layer, the first and second layers forming a space there between in which the circuit assembly is encapsulated, and a sealing area on the first and second layers at which the first and second layers are sealed together. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification