IMAGE ENGINE WITH INTEGRATED CIRCUIT STRUCTURE FOR INDICIA READING TERMINAL
First Claim
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1. An integrated circuit package for imaging decodable indicia on a target, said integrated circuit package comprising:
- a first substrate comprising integrated circuitry having a single input/output for conducting control and output signals;
a second substrate coupled to the first substrate to conduct at least one output to the single input/output;
a camera module integrated with the second substrate, the camera module comprising an image sensor die and an integrated lens assembly through which light reflected from the target passes to the image sensor die; and
an illumination module coupled to the first substrate, the illumination module comprising a first light source for directing a first light beam in the direction of the target.
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Abstract
Embodiments of the present invention comprise an image engine constructed as an IC structure that has one or more active regions for illuminating, imaging, and decoding a decodable indicia. In one embodiment of the image engine, the IC structure can comprise an imaging region, an aiming region, and an illumination region, all disposed on a single, contiguous substrate. The resultant constructed embodiment can fit within a form factor, wherein the form factor is less than about 500 mm3.
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Citations
20 Claims
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1. An integrated circuit package for imaging decodable indicia on a target, said integrated circuit package comprising:
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a first substrate comprising integrated circuitry having a single input/output for conducting control and output signals; a second substrate coupled to the first substrate to conduct at least one output to the single input/output; a camera module integrated with the second substrate, the camera module comprising an image sensor die and an integrated lens assembly through which light reflected from the target passes to the image sensor die; and an illumination module coupled to the first substrate, the illumination module comprising a first light source for directing a first light beam in the direction of the target. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor chip package for use in a hand held indicia reading terminal for imaging decodable indicia on a target, said semiconductor chip package comprising:
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a substrate comprising at least a first layer and a second layer, the first layer having a ball grid array disposed thereon and forming a first input/output, wherein the first layer comprises an illumination region that generates a first light beam in the direction of the target, wherein the second layer comprises an imaging region that comprises an image sensor die with an integrated lens assembly through which light reflected from the target passes to the image sensor die, and wherein the second layer has a second input/output coupled to the first layer in operative configuration to conduct an output from the image sensor die to the first input/output via the first layer. - View Dependent Claims (13, 14, 15, 16)
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17. A hand held indicia reading terminal for imaging decodable indicia on a target, said hand held indicia reading terminal comprising:
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an integrated circuit package for imaging the decodable indicia; and a hand held housing in surrounding relation to the integrated circuit package, wherein the integrated circuit package comprises, a first substrate that comprises a single input/output for conducting control and output signals, and a camera module that comprises a second substrate coupled to the first substrate, a image sensor die disposed on the second substrate and which is responsive to light reflected from the target, and an integrated lens assembly through which light reflected from the target passes to the image sensor die, wherein the hand held housing is operatively configured to operate the integrated circuit package via the single input/output so as to decode the decodable indicia. - View Dependent Claims (18, 19, 20)
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Specification