MICRODISPLAY PACKAGING SYSTEM

• US 20120032205A1
• Filed: 10/13/2011
• Published: 02/09/2012
• Est. Priority Date: 12/31/2003
• Status: Active Grant

• Current Assignee: Michael O'Connor, Paul C. Ward-Dolkas, Thomas W. Springett
• Original Assignee: Michael O'Connor, Paul C. Ward-Dolkas, Thomas W. Springett
• Inventors: O'Connor, Michael, Springett, Thomas W., Ward-Dolkas, Paul C.
• Granted Patent: US 8,680,572 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: G02F 1/1333 Constructional arrangements; Manufacturing methodsG02F1/135, G02F1/136 take precedence
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: G02F 1/136277 formed on a semiconductor substrate, e.g. of silicon
• CPC Class Codes: G02F 2201/54 Arrangements for reducing warping-twist
• CPC Class Codes: G02F 2203/60 Temperature independent

Abstract

Some embodiments provide a microdisplay integrated circuit (IC), a substantially transparent protective cover coupled to the microdisplay IC, and a base coupled to the microdisplay IC. Thermal expansion characteristics of the base may be substantially similar to thermal expansion characteristics of the protective cover. According to some embodiments, at least one set of imaging elements is fabricated on an upper surface of a semiconductor substrate, and a base is affixed to a lower surface of the semiconductor substrate to generate substantially negligible mechanical stress between the semiconductor substrate and the base.

Claims

1-20. -20. (canceled)

16. A device comprising:

a microdisplay integrated circuit (IC);

a substantially transparent protective cover coupled to the microdisplay IC; and

a chip carrier defining an opening,

wherein the cover extends partially into, fully into, partially through or fully through the opening.

17. A device according to claim 16, further comprising:

a base coupled to the microdisplay IC.

18. A device according to claim 17, further comprising:

a heat sink coupled to the base.

19. A device according to claim 16, wherein the chip carrier is coupled to the microdisplay IC.

20. A device according to claim 19, wherein the microdisplay IC comprises imaging elements and a bonding surface, the bonding surface comprising first conductors to carry electrical signals to the imaging elements, wherein the chip carrier comprises second conductors to carry the electrical signals, and wherein the first conductors contact respective ones of the second conductors.

21-28. -28. (canceled)