FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

• US 20120037405A1
• Filed: 05/24/2010
• Published: 02/16/2012
• Est. Priority Date: 05/26/2009
• Status: Abandoned Application

• Current Assignee: Arakawa Chemical Industries Limited
• Original Assignee: Arakawa Chemical Industries Limited
• Inventors: Goda, Hideki, Hamazawa, Akihisa, Nishimura, Koji
• Application Number:
  US13/265,042
• Publication Number:
  US 20120037405A1
• Time in Patent Office: Days
• US Class Current: 174/254
• CPC Class Codes: H05K 1/0277 Bendability or stretchability details H05K1/038, H05K3/4691 take precedence
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0344 Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
• CPC Class Codes: H05K 2201/068 wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provides a flexible circuit board, wherein at least a nickel plating layer is laminated on a polyimide film to form a polyimide film provided with a nickel plating layer and a wiring pattern is applied to the nickel plating layer thereof. The polyimide film has a thermal expansion coefficient of 0 to 8 ppm/° C. in the temperature range from 100 to 200° C., and the nickel plating layer has a thickness of 0.03 to 0.3 μm.

Claims

1. A flexible circuit board comprising a wiring pattern formed on a nickel plating layer of a polyimide film provided with a nickel plating layer that is obtained by laminating at least a nickel plating layer on a polyimide film,

the polyimide film having a coefficient of thermal expansion of 0 to 8 ppm/°

C. in the temperature range from 100 to 200°

C., and the nickel plating layer having a thickness of 0.03 to 0.3 μ

m.

2. The flexible circuit board according to claim 1, wherein the nickel plating layer has a thickness of 0.1 to 0.3 μ

m.

3. The flexible circuit board according to claim 1, which is obtained by a process comprising:

a first step of subjecting polyimide film (1) having a coefficient of thermal expansion of 0 to 8 ppm/°

C. in the temperature range from 100 to 200°

C. to at least electroless nickel plating to form a polyimide film provided with a nickel plating layer, wherein the nickel plating layer has a thickness of 0.03 to 0.3 μ

m,

a second step of forming a resist layer for pattern electrolytic copper plating by disposing a dry film resist layer on the polyimide film provided with the nickel plating layer obtained in the first step, and performing exposure and development,

a third step of forming an electrically conductive layer into a pattern by performing electrolytic copper plating on the polyimide film provided with a resist layer for pattern electrolytic copper plating obtained, and

a fourth step of selectively etching, after removing the resist layer for pattern electrolytic copper plating, the electroless nickel plating layer in the portion where the electrolytic copper plating layer is not provided.

4. A method for producing the flexible circuit board of claim 1 comprising:

a first step of subjecting polyimide film (1) having a coefficient of thermal expansion of 0 to 8 ppm/°

C. in the temperature range from 100 to 200°

C. to at least electroless nickel plating to form a polyimide film provided with a nickel plating layer, wherein the nickel plating layer has a thickness of 0.03 to 0.3 μ

m,

a second step of forming a resist layer for pattern electrolytic copper plating by disposing a dry film resist layer on the polyimide film provided with the nickel plating layer obtained in the first step, and performing exposure and development,

a third step of forming an electrically conductive layer into a pattern by performing electrolytic copper plating on the polyimide film provided with a resist layer for pattern electrolytic copper plating obtained, and

a fourth step of selectively etching, after removing the resist layer for pattern electrolytic copper plating, the electroless nickel plating layer in the portion where the electrolytic copper plating layer is not provided.

5. The method for producing a flexible circuit board according to claim 4, which further comprises forming a through hole and/or nonthrough hole in the polyimide film (1) before performing the electroless nickel plating in the first step.

6. The method for producing a flexible circuit board according to claim 4, wherein the polyimide film (1) is a block copolymerized polyimide/silica hybrid film obtained by heat curing an alkoxy-containing silane modified block copolymerized polyamic acid (b).

7. The method for producing a flexible circuit board according to claim 4, wherein, in the second step, the resist layer for pattern electrolytic copper plating is formed using a dry film resist, and, in the third step, the patterned copper circuit that is formed by electrolytic copper plating has a width of 4 to 18 μ

m.

8. The method for producing a flexible circuit board according to claim 4, wherein, in the second step, the resist layer for pattern electrolytic copper plating is formed using a dry film resist, and, in the third step, the patterned copper circuit that is formed by electrolytic copper plating has a height of 2 to 20 μ

m.

9. The method for producing a flexible circuit board according to claim 4, wherein a selective etching solution having an etching rate for copper of 0.2 μ

m/min or lower and an etching rate for electroless nickel plating layer of 1.0 μ

m/min or higher is used in the selective etching performed in the fourth step.

10. The method for producing the flexible circuit board according to claim 4, wherein an electroless copper plating layer is further formed on the electroless nickel plating layer in the first step.