FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
First Claim
1. A flexible circuit board comprising a wiring pattern formed on a nickel plating layer of a polyimide film provided with a nickel plating layer that is obtained by laminating at least a nickel plating layer on a polyimide film,the polyimide film having a coefficient of thermal expansion of 0 to 8 ppm/°
- C. in the temperature range from 100 to 200°
C., and the nickel plating layer having a thickness of 0.03 to 0.3 μ
m.
1 Assignment
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Accused Products
Abstract
An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provides a flexible circuit board, wherein at least a nickel plating layer is laminated on a polyimide film to form a polyimide film provided with a nickel plating layer and a wiring pattern is applied to the nickel plating layer thereof. The polyimide film has a thermal expansion coefficient of 0 to 8 ppm/° C. in the temperature range from 100 to 200° C., and the nickel plating layer has a thickness of 0.03 to 0.3 μm.
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Citations
10 Claims
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1. A flexible circuit board comprising a wiring pattern formed on a nickel plating layer of a polyimide film provided with a nickel plating layer that is obtained by laminating at least a nickel plating layer on a polyimide film,
the polyimide film having a coefficient of thermal expansion of 0 to 8 ppm/° - C. in the temperature range from 100 to 200°
C., and the nickel plating layer having a thickness of 0.03 to 0.3 μ
m. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
- C. in the temperature range from 100 to 200°
Specification