FLOW AND SCRUBBING PRESSURE CONTROL SYSTEM AND METHODS FOR SURFACE TREATING APPARATUS

• US 20120041605A1
• Filed: 03/26/2009
• Published: 02/16/2012
• Est. Priority Date: 03/26/2009
• Status: Active Grant

• Current Assignee: Nilfisk A/S (Nilfisk Holding A/S)
• Original Assignee: Nilfisk-Advance Incorporated (Nilfisk Holding A/S)
• Inventors: Legatt, Donald J., Graupe, Nicholas J.
• Granted Patent: US 9,192,275 B2
• Time in Patent Office: Days
• US Class Current: 700/283
• CPC Class Codes: A47L 11/283 the tools being disc brushes
• CPC Class Codes: A47L 11/40 Parts or details of machines not provided for in groups A47L11/02 - A47L11/38, or not restricted to one of these groups, e.g. handles, arrangements of switches, skirts, buffers, levers
• CPC Class Codes: G01F 1/007 by measuring the level variations of storage tanks relative to the time
• CPC Class Codes: G01F 1/34 by measuring pressure or differential pressure
• CPC Class Codes: G01F 23/18 Indicating, recording or alarm devices actuated electrically
• CPC Class Codes: G05D 11/132 by controlling the flow of the individual components G05D11/133 takes precedence

Abstract

A surface treating apparatus (10) includes a tank (100) containing a cleaning solution (102) supplied to a supply point (SP) via a fluid flow line (106) under control of a flow control module (108). A chemical pump (144) controls flow of a chemical supplied to the fluid flow line (106). A controller (130) controls the flow control module (108) to operate at an operating flow rate based on a level of the cleaning solution (102) sensed by a solution sensor (120). The controller (130) controls the chemical pump (144) to operate at a flow rate based on the operating flow rate so that the chemical is supplied to the supply point (SP) at a selected chemical dilution ratio. An agitating element (105) agitates the surface with scrubbing pressure which is adjusted by the controller (130). A spike button (168) is coupled to controller (130) and operable to momentarily increase the flow rate, chemical dilution ratio, and/or scrubbing pressure to remove unusually dirty spots.

Claims

1. A surface treating apparatus comprising, in combination:

a tank containing a cleaning solution;

a fluid flow line in communication with the tank and supplying the cleaning solution from the tank to a supply point;

an agitating element adapted to agitate a surface, with the agitating element agitating the cleaning solution with the surface;

a flow control module in line with the fluid flow line, with the flow control module permitting flow of the cleaning solution from the tank to the fluid flow line when the flow control module is open, with the flow control module being operable to control a flow rate and an amount of the cleaning solution from the tank to the fluid flow line, with the flow control module inhibiting flow of the cleaning solution from the tank through the fluid flow line to the supply point when the flow control module is closed;

a solution sensor sensing a level of the cleaning solution in the tank; and

a controller coupled to the solution sensor and the flow control module, with the controller controlling the flow control module to operate at an operating flow rate based on the level of the cleaning solution in the tank.

2. The surface treating apparatus as claimed in claim 1, with the flow control module being a solenoid valve, with the controller calculating a maximum flow rate of the solenoid valve based on the level sensed, and with the controller controlling the solenoid valve to operate at a duty cycle based on the maximum flow rate of the solenoid valve and a selected flow rate of the cleaning solution.

3. The surface treating apparatus as claimed in claim 2, with the duty cycle of the solenoid valve being 100% when the selected flow rate of the cleaning solution is greater than the maximum flow rate of the solenoid valve.

4. The surface treating apparatus as claimed in claim 2, with the solution sensor sensing a static pressure head of the cleaning solution in the tank, and with the controller determining the level of the cleaning solution in the tank using the static pressure head sensed.

5. The surface treating apparatus as claimed in claim 4, with the controller calculating a total amount of the cleaning solution in the tank based on the static pressure head and a geometry of the tank.

6. The surface treating apparatus as claimed in claim 4, further comprising, in combination:

a flow rate adjuster coupled to the controller, with the flow rate adjuster being manually operable to adjust the selected flow rate of the cleaning solution, and with the controller controlling the flow control module to operate in response to the flow rate adjuster.

7. The surface treating apparatus as claimed in claim 6, further comprising, in combination:

a chemical storage container containing a chemical;

a chemical flow line in communication with the chemical storage container and the fluid flow line, with the chemical fluid line supplying the chemical from the chemical storage container to the fluid flow line, with the chemical mixing with the cleaning solution to form a cleaning compound, with the agitating element agitating the cleaning compound with the surface; and

a chemical pump in line with the chemical flow line, with the chemical pump coupled to the controller and being operable to control a flow rate of the chemical from the chemical storage container to the fluid flow line, with the controller controlling the chemical pump to operate at a flow rate based on the operating flow rate so that the cleaning compound is supplied to the supply point at a selected chemical dilution ratio.

8. The surface treating apparatus as claimed in claim 7, further comprising, in combination:

a display coupled to the controller, with the display displaying the selected chemical dilution ratio and the level of the cleaning solution in the tank.

9. The surface treating apparatus as claimed in claim 8, further comprising, in combination:

a scrubbing pressure sensor coupled to the controller, with the agitating element agitating the surface with a scrubbing pressure, with the scrubbing pressure sensor sensing a condition indicative of the scrubbing pressure of the agitating element agitating the surface and sending a signal indicative of the scrubbing pressure to the controller; and

a scrubbing pressure adjuster coupled to the controller and manually operable to select a magnitude of the scrubbing pressure, with the controller being operable to control the scrubbing pressure of the agitating element agitating the surface indicated by the condition sensed by the scrubbing pressure sensor to be equal to the selected magnitude of the scrubbing pressure.

10. The surface treating apparatus as claimed in claim 8, with the chemical flow line intersecting with the fluid flow line intermediate the flow control module and the tank, and with the chemical mixing with the cleaning solution to form the cleaning compound before entering the flow control module.

11. The surface treating apparatus as claimed in claim 8, with the controller including a memory storing a plurality of chemical dilution ratio settings, with the surface treating apparatus further comprising, in combination:

a chemical dilution selection button manually operable to select one of the plurality of chemical dilution ratio settings, and with the display displaying the selected chemical dilution ratio selected from one of the plurality of chemical dilution ratio settings.

12. The surface treating apparatus as claimed in claim 11, with the memory further storing a plurality of flow rate settings, with the flow rate adjuster including a flow rate select button and an indicator representing the plurality of flow rate settings of the cleaning solution to be supplied to the supply point, with the flow rate select button being operable to select one of the plurality of flow rate settings of the cleaning solution, and with the selected flow rate setting indicated by the indicator.

13. The surface treating apparatus as claimed in claim 12, further comprising, in combination:

a scrubbing pressure sensor coupled to the controller, with the agitating element agitating the surface with a scrubbing pressure, with the memory further storing a plurality of scrubbing pressure settings, with the scrubbing pressure sensor sensing a condition indicative of the scrubbing pressure of the agitating element agitating the surface and sending a signal indicative of the scrubbing pressure to the controller; and

a scrubbing pressure adjuster coupled to the controller and manually operable to select one of the plurality of scrubbing pressure settings, with the controller being operable to control the scrubbing pressure of the agitating element agitating the surface indicated by the condition sensed by the scrubbing pressure sensor to be equal to the scrubbing pressure setting selected from one of the plurality of scrubbing pressure settings.

14. The surface treating apparatus as claimed in claim 13, further comprising, in combination:

a motor moving the agitating element to agitate the surface, with the plurality of scrubbing pressure settings including a plurality of amperage settings, with the motor operating at one of the plurality of amperage settings to move the agitating element to agitate the surface, and with the scrubbing pressure sensor sensing the condition of an amperage of the motor moving the agitating element agitating the surface.

15. The surface treating apparatus as claimed in claim 14, further comprising, in combination:

a spike button coupled to the controller, with the surface treating apparatus operating at the selected flow rate setting, the selected chemical dilution ratio setting, and the selected scrubbing pressure setting, with the spike button being manually operable to momentarily increase at least one of the selected flow rate setting, the selected chemical dilution ratio setting, and the selected scrubbing pressure setting so that the surface treating apparatus operates at at least one of the increased flow rate setting, the increased chemical dilution ratio setting, and the increased scrubbing pressure setting, and with the controller resuming operation of the surface treating apparatus at the selected flow rate setting, the selected chemical dilution ratio setting, and the selected scrubbing pressure setting after the momentary increase.

16. A method for agitating a surface comprising:

selecting an operating flow rate of a cleaning solution to be supplied to a supply point;

supplying the cleaning solution from a tank through a flow control module through a fluid flow line to a supply point;

agitating the cleaning solution with a surface;

sensing a level of the cleaning solution in the tank;

calculating a first flow rate of the flow control module by using the level of the cleaning solution in the tank; and

adjusting the first flow rate of the flow control module until the cleaning solution is supplied at the selected operating flow rate.

17. The method as claimed in claim 16, with sensing the level of the cleaning solution including sensing a static pressure head of the cleaning solution in the tank and determining the level of the cleaning solution in the tank using the static pressure head sensed.

18. The method as claimed in claim 17, with supplying the cleaning solution including supplying the cleaning solution to the fluid flow line through the flow control module in the form of a solenoid valve, with calculating the first flow rate of the flow control module including calculating a maximum flow rate of the solenoid valve based on the static pressure head sensed, and with adjusting the first flow rate including controlling the solenoid valve to operate at a duty cycle based on the maximum flow rate of the solenoid valve and the selected operating flow rate of the cleaning solution.

19. The method as claimed in claim 18, further comprising:

supplying a chemical to the fluid flow line, with the cleaning solution mixing with the chemical to form a cleaning compound before supplying the cleaning solution to the supply point;

selecting a chemical dilution ratio;

calculating a second flow rate of the chemical by using the level of the cleaning solution in the tank; and

adjusting the second flow rate until the cleaning compound is supplied at the selected chemical dilution ratio.

20. The method as claimed in claim 19, with agitating the cleaning solution with the surface comprising agitating the surface with a scrubbing pressure, with the method further comprising:

sensing a condition indicative of the scrubbing pressure agitating the surface;

selecting a magnitude of the scrubbing pressure;

comparing the selected magnitude of the scrubbing pressure with the scrubbing pressure indicated by the condition sensed; and

adjusting the scrubbing pressure until the scrubbing pressure indicated by the condition sensed is equal to the selected magnitude of the scrubbing pressure.

21. The method as claimed in claim 20, with agitating the cleaning solution including moving an agitating element with a motor, and with sensing the condition indicative of the scrubbing pressure including sensing an amperage of the motor moving the agitating element.

22. A method for treating a surface comprising:

inputting an operating parameter into a controller;

operating an agitating element to move relative to the surface under control of the controller according to the operating parameter in a normal condition; and

inputting a spike condition into the controller, with the controller changing the operating parameter momentarily for a period of time to other than the normal condition, with the controller operating the agitating element according to the changed parameter in the spike condition for the period of time, with the operating parameter returning to the normal condition after the period of time.

23. The method as claimed in claim 22, with inputting the operating parameter comprising inputting a flow rate of a cleaning solution to be agitated with the surface by the agitating element.

24. The method as claimed in claim 23, further comprising:

storing in a memory a plurality of increasing flow rate settings, with inputting the flow rate comprising selecting one of the plurality of flow rate settings, with the controller providing the cleaning solution in the normal condition according to the selected one of the plurality of flow rate setting, and with changing the operating parameter when the spike condition is inputted comprising changing the selected one of the plurality of flow rate setting to another of the plurality of flow rate settings of a flow rate larger than the selected one of the plurality of flow rate settings, with the controller providing the cleaning solution in the spike condition according to the another of the plurality of flow rate settings for the period of time.

25. The method claim as claimed in claim 24, with inputting the operating parameter further comprising inputting a chemical dilution ratio of the cleaning solution and a chemical in a cleaning compound to be agitated with the surface.

26. The method as claimed in claim 25, further comprising:

storing in the memory a plurality of increasing chemical dilution ratio settings, with inputting the chemical dilution ratio comprising selecting one of the plurality of chemical dilution ratio settings and supplying the chemical to the cleaning solution in the normal condition according to the selected one of the plurality of chemical dilution ratio settings, with the agitating element agitating the cleaning compound on the surface, and with changing the operating parameter when the spike condition is inputted further comprising changing the selected one of the plurality of chemical dilution ratio settings to another of the plurality of chemical dilution ratio settings of a chemical dilution ratio larger than the selected one of the plurality of chemical dilution ratio settings, with the controller supplying the chemical to the cleaning solution in the spike condition according to the another of the plurality of chemical dilution ratio settings for the period of time.

27. The method as claimed in claim 26, with inputting the operating parameter further comprising inputting a scrubbing pressure, with the controller moving the agitating element against the surface with the scrubbing pressure.

28. The method as claimed in claim 27, further comprising:

storing in the memory a plurality of increasing scrubbing pressure settings, with inputting the scrubbing pressure comprising selecting one of the scrubbing pressure settings and moving the agitating element against the surface with the selected one of the plurality of scrubbing pressure settings in the normal condition, and with changing the operating parameter when the spike condition is inputted further comprising changing the selected one of the plurality of scrubbing pressure settings to another of the plurality of scrubbing pressure settings of a scrubbing pressure magnitude larger than the selected one of the plurality of scrubbing pressure settings, with the controller moving the agitating element against the surface in the spike condition according to the another of the plurality of scrubbing pressure settings for the period of time.

29. The method as claimed in claim 24, with inputting the operating parameter further comprising inputting a scrubbing pressure, with the controller moving the agitating element against the surface with the scrubbing pressure.

30. The method as claimed in claim 29, further comprising:

storing in the memory a plurality of increasing scrubbing pressure settings, with inputting the scrubbing pressure comprising selecting one of the scrubbing pressure settings and moving the agitating element against with the selected one of the plurality of scrubbing pressure settings in the normal condition, and with changing the operating parameter when the spike condition is inputted further comprising changing the selected one of the plurality of scrubbing pressure settings to another of the plurality of scrubbing pressure settings of a scrubbing pressure magnitude larger than the selected one of the plurality of scrubbing pressure settings, with the controller moving the agitating element against the surface in the spike condition according to the another of the plurality of scrubbing pressure settings for the period of time.

31. The method as claimed in claim 22, with inputting the operating parameter comprising inputting a chemical dilution ratio of a cleaning solution and a chemical in a cleaning compound to be agitated with the surface.

32. The method as claimed in claim 31, further comprising:

storing in a memory a plurality of increasing chemical dilution ratio settings, with inputting the chemical dilution ratio comprising selecting one of the plurality of chemical dilution ratio settings and supplying the chemical to the cleaning solution in the normal condition according to the selected one of the plurality of chemical dilution ratio settings, with the agitating element agitating the cleaning compound on the surface, and with changing the operating parameter when the spike condition is inputted comprising changing the selected one of the plurality of chemical dilution ratio settings to another of the plurality of chemical dilution ratio settings of a chemical dilution ratio larger than the selected one of the plurality of chemical dilution ratio settings, with the controller supplying the chemical to the cleaning solution in the spike condition according to the another of the plurality of chemical dilution ratio settings for the period of time.

33. The method as claimed in claim 32, with inputting the operating parameter further comprising inputting a scrubbing pressure, with the controller moving the agitating element against the surface with the scrubbing pressure.

34. The method as claimed in claim 33, further comprising:

storing in the memory a plurality of increasing scrubbing pressure settings, with inputting the scrubbing pressure comprising selecting one of the scrubbing pressure settings and moving the agitating element against the surface with the selected one of the plurality of scrubbing pressure settings in the normal condition, and with changing the operating parameter when the spike condition is inputted comprising changing the selected one of the plurality of scrubbing pressure settings to another of the plurality of scrubbing pressure settings of a scrubbing pressure magnitude larger than the selected one of the plurality of scrubbing pressure settings, with the controller moving the agitating element against the surface in the spike condition according to the another of the plurality of scrubbing pressure settings for the period of time.

35. The method as claimed in claim 22, with inputting the operating parameter comprising inputting a scrubbing pressure, with the controller moving the agitating element against the surface with the scrubbing pressure.

36. The method as claimed in claim 35, further comprising:

storing in a memory a plurality of increasing scrubbing pressure settings, with inputting the scrubbing pressure comprising selecting one of the scrubbing pressure settings and moving the agitating element against the surface with the selected one of the plurality of scrubbing pressure settings in the normal condition, and with changing the operating parameter when the spike condition is inputted comprising changing the selected one of the plurality of scrubbing pressure settings to another of the plurality of scrubbing pressure settings of a scrubbing pressure magnitude larger than the selected one of the plurality of scrubbing pressure settings, with the controller moving the agitating element against the surface in the spike condition according to the another of the plurality of scrubbing pressure settings for the period of time.

37. A surface treating apparatus comprising, in combination:

an agitating element moving relative to a surface;

a controller controlling the agitating element to move relative to the surface;

a first adjuster operatively connected to the controller and selecting an operating parameter of the agitating element under control of the controller; and

a spike button operatively connected to the controller, with the controller momentarily changing the operating parameter of the agitating element for a period of time when the spike button is operated, with the controller resuming the operating parameter of the agitating element after the period of time.

38. The surface treating apparatus as claimed in claim 37, with the first adjuster selecting a flow rate of a cleaning solution to be supplied to the surface, with the agitating element agitating the cleaning solution on the surface, with the controller including a memory storing a plurality of flow rate settings, with the first adjuster selecting the operating parameter from one of the plurality of flow rate settings, with the controller providing the cleaning solution to the surface according to the selected one of the plurality of flow rate settings, with the controller changing the selected one of the plurality of flow rate settings to another of the plurality of flow rate settings of a flow rate larger than the selected one of the plurality of flow rate settings for a period of time when the spike button is operated, with the controller providing the cleaning solution to the surface according to the another of the plurality of flow rate settings for the period of time when the spike button is operated, and with the controller providing the cleaning solution to the surface according to the selected one of the plurality of flow rate settings after the period of time.

39. The surface treating apparatus as claimed in claim 38, further comprising, in combination:

a second adjuster operatively connected to the controller, with the second adjuster selecting a chemical dilution ratio of the cleaning solution and a chemical of a cleaning compound under control of the controller, with the agitating element agitating the cleaning compound on the surface, with the controller including a memory storing a plurality of chemical dilution ratio settings, with the second adjuster selecting one of the plurality of chemical dilution ratio settings, with the controller supplying the cleaning compound to the cleaning solution according to the selected one of the plurality of chemical dilution ratio settings, with the controller changing the selected one of the plurality of chemical dilution ratio settings to another of the plurality of chemical dilution ratio settings of a chemical dilution ratio larger than the selected one of the plurality of chemical dilution ratio settings for a period of time when the spike button is operated, with the controller supplying the cleaning compound to the surface according to the another of the plurality of chemical dilution ratio settings for the period of time when the spike button is operated, and with the controller supplying the cleaning compound to the surface according to the selected one of the plurality of chemical dilution ratio settings after the period of time.

40. The surface treating apparatus as claimed in claim 39, further comprising, in combination:

a third adjuster operatively connected to the controller, with the third adjuster selecting a scrubbing pressure of the agitating element agitating the surface under control of the controller, with the controller including a memory storing a plurality of scrubbing pressure settings, with the third adjuster selecting one of the plurality of scrubbing pressure settings, with the controller controlling the agitating element to agitate the surface according to the selected one of the plurality of scrubbing pressure settings, with the controller changing the selected one of the plurality of scrubbing pressure settings to another of the plurality of scrubbing pressure settings of a scrubbing pressure magnitude larger than the selected one of the plurality of scrubbing pressure settings for a period of time when the spike button is operated, with the controller controlling the agitating element to agitate the surface according to the another of the plurality of scrubbing pressure settings for the period of time when the spike button is operated, and with the controller controlling the agitating element to agitate the surface according to the selected one of the plurality of scrubbing pressure settings after the period of time.

41. The surface treating apparatus as claimed in claim 38, further comprising, in combination:

a second adjuster operatively connected to the controller, with the second adjuster selecting a scrubbing pressure of the agitating element agitating the surface under control of the controller, with the controller including a memory storing a plurality of scrubbing pressure settings, with the second adjuster selecting one of the plurality of scrubbing pressure settings, with the controller controlling the agitating element to agitate the surface according to the selected one of the plurality of scrubbing pressure settings, with the controller changing the selected one of the plurality of scrubbing pressure settings to another of the plurality of scrubbing pressure settings of a scrubbing pressure magnitude larger than the selected one of the plurality of scrubbing pressure settings for a period of time when the spike button is operated, with the controller controlling the agitating element to agitate the surface according to the another of the plurality of scrubbing pressure settings for the period of time when the spike button is operated, and with the controller controlling the agitating element to agitate the surface according to the selected one of the plurality of scrubbing pressure settings after the period of time.

42. The surface treating apparatus as claimed in claim 37, with the first adjuster selecting a chemical dilution ratio of a cleaning solution and a chemical of a cleaning compound to be supplied to the surface, with the agitating element agitating the cleaning compound on the surface, with the controller including a memory storing a plurality of chemical dilution ratio settings, with the first adjuster selecting the operating parameter from one of the plurality of chemical dilution ratio settings, with the controller supplying the cleaning compound to the cleaning solution according to the selected one of the plurality of chemical dilution ratio settings, with the controller changing the selected one of the plurality of chemical dilution ratio settings to another of the plurality of chemical dilution ratio settings of a chemical dilution ratio larger than the selected one of the plurality of chemical dilution ratio settings for a period of time when the spike button is operated, with the controller supplying the cleaning compound to the surface according to the another of the plurality of chemical dilution ratio settings for the period of time when the spike button is operated, and with the controller supplying the cleaning compound to the surface according to the selected one of the plurality of chemical dilution ratio settings after the period of time.

43. The surface treating apparatus as claimed in claim 42, further comprising, in combination:

a second adjuster operatively connected to the controller, with the second adjuster selecting a scrubbing pressure of the agitating element agitating the surface under control of the controller, with the controller including a memory storing a plurality of scrubbing pressure settings, with the second adjuster selecting one of the plurality of scrubbing pressure settings, with the controller controlling the agitating element to agitate the surface according to the selected one of the plurality of scrubbing pressure settings, with the controller changing the selected one of the plurality of scrubbing pressure settings to another of the plurality of scrubbing pressure settings of a scrubbing pressure magnitude larger than the selected one of the plurality of scrubbing pressure settings for a period of time when the spike button is operated, with the controller controlling the agitating element to agitate the surface according to the another of the plurality of scrubbing pressure settings for the period of time when the spike button is operated, and with the controller controlling the agitating element to agitate the surface according to the selected one of the plurality of scrubbing pressure settings after the period of time

44. The surface treating apparatus as claimed in claim 37, with the first adjuster selecting a scrubbing pressure of the agitating element agitating the surface, with the controller including a memory storing a plurality of scrubbing pressure settings, with the first adjuster selecting the operating parameter from one of the plurality of scrubbing pressure settings, with the controller controlling the agitating element to agitate the surface according to the selected one of the plurality of scrubbing pressure settings, with the controller changing the selected one of the plurality of scrubbing pressure settings to another of the plurality of scrubbing pressure settings of a scrubbing pressure magnitude larger than the selected one of the plurality of scrubbing pressure settings for a period of time when the spike button is operated, with the controller controlling the agitating element to agitate the surface according to the another of the plurality of scrubbing pressure settings for the period of time when the spike button is operated, and with the controller controlling the agitating element to agitate the surface according to the selected one of the plurality of scrubbing pressure settings after the period of time.