MEMS Pressure Sensor Device and Method of Fabricating Same
First Claim
1. A method of producing a microelectromechanical systems (MEMS) sensor device comprising:
- forming a first substrate structure having a cavity;
forming a sense element from a material layer of a second substrate structure;
coupling said second substrate structure with said first substrate structure such that said sense element is interposed between said first and second substrate structures and is aligned with said cavity; and
forming a reference element in said second substrate structure aligned with said sense element, said reference element including a plurality of openings extending through said second substrate structure, wherein said sense element is exposed to an environment external to said MEMS sensor device via one of a group consisting of said cavity and said plurality of openings.
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Abstract
A microelectromechanical systems (MEMS) pressure sensor device (20, 62) includes a substrate structure (22, 64) having a cavity (32, 68) formed therein and a substrate structure (24) having a reference element (36) formed therein. A sense element (44) is interposed between the substrate structures (22, 24) and is spaced apart from the reference element (36). The sense element (44) is exposed to an external environment (48) via one of the cavity (68) and a plurality of openings (38) formed in the reference element (36). The sense element (44) is movable relative to the reference element (36) in response to a pressure stimulus (54) from the environment (48). Fabrication methodology (76) entails forming (78) the substrate structure (22, 64) having the cavity (32, 68), fabricating (84) the substrate structure (24) including the sense element (44), coupling (92) the substrate structures, and subsequently forming (96) the reference element (36) in the substrate structure (24).
39 Citations
20 Claims
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1. A method of producing a microelectromechanical systems (MEMS) sensor device comprising:
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forming a first substrate structure having a cavity; forming a sense element from a material layer of a second substrate structure; coupling said second substrate structure with said first substrate structure such that said sense element is interposed between said first and second substrate structures and is aligned with said cavity; and forming a reference element in said second substrate structure aligned with said sense element, said reference element including a plurality of openings extending through said second substrate structure, wherein said sense element is exposed to an environment external to said MEMS sensor device via one of a group consisting of said cavity and said plurality of openings. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A microelectromechanical systems (MEMS) sensor device comprising;
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a first substrate structure having a cavity formed therein; and a second substrate structure having a reference element formed in said second substrate structure and aligned with said cavity, said reference element including a plurality of openings extending through said second substrate structure; a sense element disposed on a first side of said second substrate structure and aligned with said reference element, said sense element being spaced apart from said reference element to form a gap between said sense element and said reference element, said sense element being exposed to an environment external to said MEMS sensor device via one of a group consisting of said cavity and said plurality of openings, and said sense element being movable relative to said reference element in response to a pressure stimulus from said environment. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A method of producing a microelectromechanical systems (MEMS) sensor device comprising:
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forming a first substrate structure including a cavity; forming a sense element from a material layer on a first side of a second substrate structure, said forming said sense element including depositing a sacrificial layer on a wafer substrate and depositing said material layer on said sacrificial layer; coupling said second substrate structure with said first substrate structure such that said sense element is interposed between said first and second substrate structures and is aligned with said cavity; forming a reference element in said second substrate structure aligned with said sense element, said reference element including a plurality of openings extending through said second substrate; removing said sacrificial layer between said reference element and said sense element via said plurality of openings in said reference element following said coupling operation, said removing operation producing a gap between said reference element and said sense element; and attaching a cap to a second side of said second substrate structure to form a chamber in which said reference element is located, wherein said sense element is exposed to an environment external to said MEMS sensor device via one of said cavity and said plurality of openings, and said sense element is movable relative to said reference element in response to a pressure stimulus from said environment. - View Dependent Claims (19, 20)
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Specification