PRESSURE SENSOR

• US 20120042734A1
• Filed: 08/23/2010
• Published: 02/23/2012
• Est. Priority Date: 08/23/2010
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Wade, Richard, Bentley, Ian
• Granted Patent: US 8,230,743 B2
• Time in Patent Office: Days
• US Class Current: 73/862.381
• CPC Class Codes: G01L 19/0627 Protection against aggressive medium in general
• CPC Class Codes: G01L 19/143 Two part housings
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: G01L 9/0052 of piezoresistive elements circuits therefor G01L9/06
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: Y10T 29/4998 Combined manufacture including applying or shaping of fluent material

Abstract

A pressure sensor is disclosed that can help isolate the sensor and/or sensor components from a media to be sensed and/or can help reduce sensor damage caused by harsh operating environments. In one illustrative embodiment, the pressure sensor may include a substrate having a pressure sensing die mounted on a first side of the substrate, a first housing member defining a first cavity around the pressure sensing die, and a second housing member defining a second cavity on the second side of the substrate. A passivating agent, such as a gel, can be positioned in both the first cavity and the second cavity to transmit pressure from the media to a pressure sensing element (e.g. diaphragm) while isolating the pressure sensing element and other components from the media. In some cases, the first housing member and/or the second housing member may include an opening for exposing the passivating agent to the media. The opening may be defined by one or more tapered and/or chamfered edges to help provide freeze damage protection.

Claims

1. A pressure sensor comprising:

a substrate including a first side and a second side, the substrate including an opening extending between the first side and the second side;

a pressure sensing die mounted directly on the first side of the substrate with an adhesive, wherein the pressure sensing die includes a diaphragm and one or more piezoresistive elements positioned on the diaphragm, wherein the pressure sensing die is positioned over the opening;

a first housing member positioned on the first side of the substrate and defining a first cavity around the pressure sensing die, wherein the first housing member includes a first pressure opening defined by one or more first edges of the first housing member, wherein the one or more first edges are tapered and/or chamfered;

a first flourosilicone gel positioned in the first cavity to cover at least part of the pressure sensing die and at least part of the first side of the substrate;

a second housing member positioned on the second side of the substrate and defining a second cavity, wherein the second housing member includes a second pressure opening defined by one or more second edges of the second housing member; and

a second flourosilicone gel positioned in the second cavity to cover at least part of the second side of the substrate.

2. A pressure sensor comprising:

a substrate including a first side and a second side, the substrate including an opening extending between the first side and the second side;

a pressure sensing die mounted directly on the first side of the substrate with an adhesive, wherein the pressure sensing die includes a diaphragm and one or more piezoresistive elements positioned on the diaphragm, wherein the pressure sensing die is positioned over the opening;

a first housing member positioned on the first side of the substrate and defining a first cavity around the pressure sensing die, wherein the first housing member includes a first pressure opening defined by one or more first edges of the first housing member;

a first passivating agent positioned in the first cavity to cover at least part of the pressure sensing die and at least part of the first side of the substrate;

a second housing member positioned on the second side of the substrate and defining a second cavity, wherein the second housing member includes a second pressure opening defined by one or more second edges of the second housing member; and

a second passivating agent positioned in the second cavity to cover at least part of the second side of the substrate.

3. The pressure sensor of claim 2, wherein the first passivating agent in the first cavity is configured to transmit pressure from the first pressure opening to a top side of the diaphragm and, wherein the second passivating agent in the second cavity is configured to transmit pressure from the second pressure opening to a bottom side of the diaphragm via the opening in the substrate.

4. The pressure sensor of claim 2, wherein the first passivating agent has a first thickness in the first cavity and the second passivating agent has a second thickness in the second cavity, wherein the second thickness is less than the first thickness.

5. The pressure sensor of claim 2, wherein the second passivating agent has a non-uniform thickness in the second cavity.

6. The pressure sensor of claim 2, wherein the substrate includes a ceramic material.

7. The pressure sensor of claim 2, wherein the adhesive for mounting the pressure sensing die to the first side of the substrate is RTV.

8. The pressure sensor of claim 2, further comprising signal conditioning circuitry mounted on the first side of the substrate in electrical communication with the pressure sensing die, wherein the signal conditioning circuitry is configured receive a signal from the pressure sensing die and condition the signal to provide a conditioned output signal from the pressure sensor.

9. The pressure sensor of claim 2, wherein the first and second passivating agents includes a gel.

10. The pressure sensor of claim 9, wherein the gel includes a flourosilicone gel.

11. The pressure sensor of claim 9, wherein a first gel is disposed in the first cavity and a second gel is disposed in the second cavity, wherein the first gel and the second gel are different.

12. The pressure sensor of claim 2, wherein the one or more first edges are tapered and/or chamfered.

13. A pressure sensor comprising:

a substrate including a first side and a second side;

a pressure sensing element mounted on the first side of the substrate;

a first housing member positioned on the first side of the substrate and defining a first cavity around the pressure sensing element, wherein the first housing member includes a first pressure opening defined by one or more tapered and/or chamfered first edges; and

a first passivating agent disposed in the first cavity covering at least part of the pressure sensing element, wherein the first passivating agent is configured to transmit a pressure of a first media at the first pressure opening to the pressure sensing element while isolating the pressure sensing element from the first media.

14. The pressure sensor of claim 13, further comprising:

a second housing positioned on the second side of the substrate and defining a second cavity to define a second chamber, the second housing including a second pressure opening; and

a second passivating agent disposed in the second cavity, wherein the second passivating agent is configured to transmit a pressure of a second media at the second pressure opening to the pressure sensing element via an opening in the substrate while isolating the pressure sensing element from the second media.

15. The pressure sensor of claim 13, further comprising signal conditioning circuitry mounted on the first side of the substrate in electrical communication with the pressure sensing element, wherein the signal conditioning circuitry is configured receive a signal from the pressure sensing element and condition the signal to provide a conditioned output signal from the pressure sensor.

16. The pressure sensor of claim 14, wherein the first and second passivating agents include a flourosilicone gel.

17. A method of manufacturing a pressure sensor, the method comprising:

mounting a pressure sensing die on a first side of a substrate, wherein the pressure sensing die includes a pressure sensing diaphragm;

mounting a first housing member on the first side of the substrate to form a first cavity around the pressure sensing die, wherein the first housing member includes a first pressure opening defined by one or more first edges of the first housing member;

filling at least a portion of the first cavity with a first gel to cover at least part of the pressure sensing die;

mounting a second housing member on a second side of the substrate to form a second cavity, wherein the second housing member includes a second pressure opening defined by one or more second edges of the second housing member; and

filling at least a portion of the second cavity with a second gel.

18. The method of claim 17, wherein the first gel is configured to transmit pressure from the first pressure opening to a top side of the pressure sensing diaphragm, and the second gel is configured to transmit pressure from the second pressure opening to a bottom side of the pressure sensing diaphragm via an opening in the substrate.

19. The method of claim 17, wherein the one or more first edges are tapered and/or chamfered.

20. The method of claim 17, wherein the first gel has a different thickness than the second gel.

21. The method of claim 17, wherein the second gel has a non-uniform thickness.