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PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

  • US 20120043127A1
  • Filed: 11/30/2010
  • Published: 02/23/2012
  • Est. Priority Date: 08/20/2010
  • Status: Active Grant
First Claim
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1. A printed circuit board, comprising:

  • a core substrate having a first surface and an opposite second surface;

    a first through hole and a second through hole formed through a portion of the core substrate, respectively, from the first surface and second surface, wherein the first and second through holes are laminated vertically and communicate with each other; and

    a first guide rail and a second guide rail, respectively, formed through a portion of the core substrate and communicating with the second through hole, so that a fluid flows from an outside of the printed circuit board through the first guide rail, the second through hole and the second guide rail, to the outside of the printed circuit board in sequence, and heat generated from a semiconductor device disposed in the first through hole is transmitted to the outside of the printed circuit board.

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