PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
First Claim
1. A printed circuit board, comprising:
- a core substrate having a first surface and an opposite second surface;
a first through hole and a second through hole formed through a portion of the core substrate, respectively, from the first surface and second surface, wherein the first and second through holes are laminated vertically and communicate with each other; and
a first guide rail and a second guide rail, respectively, formed through a portion of the core substrate and communicating with the second through hole, so that a fluid flows from an outside of the printed circuit board through the first guide rail, the second through hole and the second guide rail, to the outside of the printed circuit board in sequence, and heat generated from a semiconductor device disposed in the first through hole is transmitted to the outside of the printed circuit board.
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Accused Products
Abstract
The invention provides a printed circuit board and a method for fabricating the same. The printed circuit board includes a core substrate having a first surface and an opposite second surface. A first through hole and a second through hole are formed through a portion of the core substrate, respectively from the first surface and second surfaces, wherein the first and second through holes are laminated vertically and connect to each other. A first guide rail and a second guide rail are, respectively, formed through a portion of the core substrate and connected to the second through hole, so that a fluid flows sequentially from an outside of the printed circuit board through the first guide rail, the second through hole and the second guide rail, to the outside of the printed circuit board.
25 Citations
16 Claims
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1. A printed circuit board, comprising:
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a core substrate having a first surface and an opposite second surface; a first through hole and a second through hole formed through a portion of the core substrate, respectively, from the first surface and second surface, wherein the first and second through holes are laminated vertically and communicate with each other; and a first guide rail and a second guide rail, respectively, formed through a portion of the core substrate and communicating with the second through hole, so that a fluid flows from an outside of the printed circuit board through the first guide rail, the second through hole and the second guide rail, to the outside of the printed circuit board in sequence, and heat generated from a semiconductor device disposed in the first through hole is transmitted to the outside of the printed circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for fabricating a printed circuit board, comprising:
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providing a core substrate having a first surface and an opposite second surface; removing a portion of the core substrate from the first surface to form a first through hole in the core substrate; and removing a portion of the core substrate from the second surface to form a second through hole, a first guide rail and a second guide rail in the core substrate, wherein the first and second through holes are laminated vertically and communicate with each other, and the first guide rail and the second guide rail, respectively, communicate with the second through hole, so that a fluid flows from an outside of the printed circuit board through the first guide rail, the second through hole and the second guide rail, to the outside of the printed circuit board in sequence, so that heat generated from a semiconductor device disposed in the first through hole is transmitted to the outside of the printed circuit board. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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Specification