RESILIENT CONDUCTIVE ELECTRICAL INTERCONNECT
1 Assignment
0 Petitions
Accused Products
Abstract
An interconnect assembly including a resilient material with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete, free-flowing conductive particles is located in the through holes. The conductive particles are preferably substantially free of non-conductive materials. A plurality of first contact tips are located in the through holes adjacent the first surface and a plurality of second contact tips are located in the through holes adjacent the second surface. The resilient material provides the required resilience, while the conductive particles provide a conductive path substantially free of non-conductive materials.
76 Citations
48 Claims
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1-27. -27. (canceled)
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28. An interconnect assembly comprising:
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a resilient material printed to include a plurality of through holes extending from a first surface to a second surface and a plurality of recesses corresponding to desired circuit traces; a plurality of discrete, free-flowing conductive particles located in the through holes, the conductive particles being substantially free of non-conductive materials; a plurality of first contact tips located in the through holes adjacent the first surface; a plurality of second contact tips located in the through holes adjacent the second surface; and a conductive material printed in at least a portion of the recesses comprising conductive traces electrically coupled to one or more of the contact tips. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A method of forming an interconnect assembly comprising:
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locating a plurality of first contact tips on a carrier; printing a resilient material on the carrier with a plurality of through holes generally aligned with the first contact tips and a plurality of recesses corresponding to desired circuit traces; depositing a plurality of discrete, free-flowing conductive particles in the through holes, the conductive particles being substantially free of non-conductive materials; printing conductive material in at least a portion of the recesses comprising conductive traces electrically coupled to one or more of the contact tips; locating a plurality of second contact tips in the through holes adjacent a second surface; and separating the carrier from the first contact tips and the resilient material. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47, 48)
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Specification