PACKAGED DEVICE INCLUDING A WELL FOR CONTAINING A DIE
First Claim
Patent Images
1. A packaged device, comprising:
- a package defining a well having a well top;
a die positioned in the well of the package; and
a retaining substrate attached to the package over the well top, the retaining substrate holding the die in direct contact with a portion of the package exposed at a well bottom opposite the well top.
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Accused Products
Abstract
A packaged device includes a package defining a well having a well top, a die positioned in the well of the package, and a retaining substrate attached to the package over the well top. The retaining substrate holds the die in direct contact with a portion of the package exposed at a well bottom opposite the well top.
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Citations
20 Claims
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1. A packaged device, comprising:
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a package defining a well having a well top; a die positioned in the well of the package; and a retaining substrate attached to the package over the well top, the retaining substrate holding the die in direct contact with a portion of the package exposed at a well bottom opposite the well top. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A packaged device, comprising:
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a lead frame; a plastic portion molded on the lead frame and defining a well; a die positioned in the well of the package, a bottom surface of the die directly contacting a top portion of the lead frame exposed at a bottom of the well; and an adhesive dispensed between at least one sidewall of the well and a corresponding at least one side the die, the adhesive holding the die in direct contact with the top portion of the lead frame exposed at the bottom of the well. - View Dependent Claims (16, 17)
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18. A device package, comprising:
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a lead frame; a plastic portion molded on the lead frame; a well formed through a first surface of the plastic portion and exposing a portion of the lead frame, the well containing a micro electro-mechanical system (MEMS) transducer device; a retaining substrate attached to the well, the retaining substrate holding the MEMS transducer device in direct contact with the exposed portion of the lead frame; and a pressure port formed through the lead frame and a second surface of the plastic portion opposite the well, wherein the MEMS transducer device comprises a membrane and a back-etched portion substantially aligned with the pressure port and an opening formed through the retaining substrate. - View Dependent Claims (19, 20)
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Specification