INTEGRATED THERMAL PACKAGING OF HIGH POWER MOTOR CONTROLLER

• US 20120044646A1
• Filed: 08/20/2010
• Published: 02/23/2012
• Est. Priority Date: 08/20/2010
• Status: Active Grant

• Current Assignee: Hamilton Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Hamilton Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Pal, Debabrata
• Granted Patent: US 8,289,711 B2
• Time in Patent Office: Days
• US Class Current: 361/702
• CPC Class Codes: H05K 7/20909 Forced ventilation, e.g. on heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

According to an example provided herein, a cold plate has a surface for mounting a component thereto, a first path to flow cooling fluid therethrough in a vicinity of the surface and a housing mounted on the surface that extends from the surface. The housing has a second path attaching to the first path to flow fluid to flow through the housing wherein the housing is designed to at least partially enclose the component and wherein the component is cooled by the housing.

Claims

1. A cold plate comprising:

a surface for mounting a component thereto,

a first path to flow cooling fluid therethrough in a vicinity of said surface and

a housing mounted on said surface and extending therefrom, said housing having a second path attaching to said first path to flow fluid through said housing,

wherein said housing is designed to at least partially enclose said component and wherein said component is cooled by said housing.

2. The cold plate of claim 1 wherein said housing further comprises an outer wall for mounting an electrical part wherein said electrical part is cooled by said housing.

3. The cold plate of claim 1 wherein said component has a first shape and said housing is designed with a second shape that mimics said first shape.

4. The cold plate of claim 1 wherein said second path is tortuous.

5. The cold plate of claim 1 wherein said second path includes fin cores embedded within an interior of said housing.

6. A cold plate comprising:

a surface having a component requiring cooling mounted thereto,

a first path to flow cooling fluid therethrough in a vicinity of said surface, and,

a housing mounted on said surface and extending therefrom, said housing having a second path attaching to said first path to flow fluid through said housing,

wherein said housing at least partially encloses said component and wherein said component is cooled by said housing.

7. The cold plate of claim 6 wherein said housing further comprises an outer wall for mounting a part requiring cooling wherein said part is cooled by said housing.

8. The cold plate of claim 6 wherein said component has a first shape and said housing has a second shape that mimics said first shape.

9. The cold plate of claim 6 wherein said second path is tortuous.

10. The cold plate of claim 6 wherein said second path includes fin cores embedded within an interior of said housing.

11. The cold plate of claim 6 wherein said component is an inductor.

12. The cold plate of claim 7 wherein said part is an inverter power module and said component is an inductor.

13. The cold plate of claim 11 wherein said inductor further comprises a coil, windings disposed about said coil and potting compound disposed between said coil and said housing.

14. A method for minimizing a size of an electronics package requiring cooling, said method comprising:

determining a component in said electronics package that requires cooling,

providing a cooling housing for said component that at least partially encloses said component, said housing attaching to a cooling plate, wherein said housing removes heat from said component and,

mounting a part needing cooling to said housing.

15. The method claim 14 further comprising:

flowing cooling fluid from said cooling plate through said housing.

16. The method of claim 14 further comprising mounting said component within said housing and mounting said part outside of said housing.