LED CHIP PACKAGE STRUCTURE WITH A HIGH-EFFICIENCY HEAT-DISSIPATING SUBSTRATE AND METHOD FOR MAKING THE SAME

• US 20120049212A1
• Filed: 11/09/2011
• Published: 03/01/2012
• Est. Priority Date: 03/05/2008
• Status: Abandoned Application

• Current Assignee: Harvatek Corporation
• Original Assignee: Harvatek Corporation
• Inventors: WANG, BILY, WU, SHIH-YU, WU, WEN-KUEI
• Application Number:
  US13/292,376
• Publication Number:
  US 20120049212A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 6/0068 Arrangements of plural sources, e.g. multi-colour light sources
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05K 3/202 using self-supporting metal foil pattern

Abstract

An LED chip package structure with a high-efficiency heat-dissipating substrate includes a substrate unit, an adhesive body, a plurality of LED chips, package bodies and frame layers. The substrate unit has a positive substrate, a negative substrate, and a plurality of bridge substrates separated from each other and disposed between the positive and the negative substrate. The adhesive body is filled between the positive, the negative and the bridge substrates in order to connect and fix the positive substrate, the negative substrate and the bridge substrates together. The LED chips are disposed on the substrate unit and electrically connected between the positive substrate and the negative substrate. The package bodies are respectively covering the LED chips. The frame layers are respectively disposed around the packages bodies in order to form a plurality of light-projecting surfaces on the package bodies, and the light-projecting surfaces correspond to the LED chips.

Claims

1. An LED chip package structure with a high-efficiency heat-dissipating substrate, comprising:

a substrate unit having a positive substrate, a negative substrate, and a plurality of bridge substrates separated from each other and disposed between the positive substrate and the negative substrate;

an adhesive body filled between the positive substrate, the negative substrate and the bridge substrates in order to connect and fix the positive substrate, the negative substrate and the bridge substrates together;

a plurality of LED chips disposed on the substrate unit and electrically connected between the positive substrate and the negative substrate;

a plurality of package bodies respectively covering the LED chips; and

a plurality of frame layers respectively disposed around the packages bodies in order to form a plurality of light-projecting surfaces on the package bodies, wherein the light-projecting surfaces correspond to the LED chips;

wherein each package body is a transparent body, and each LED chip is used for generating white light.

2. The LED chip package structure as claimed in claim 1, wherein the substrate unit is a PCB (Printed Circuit Board), a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate.

3. The LED chip package structure as claimed in claim 1, wherein each LED chip has a positive side and a negative side respectively and electrically connected with the positive substrate and the negative substrate of the substrate unit via two leading wires using a wire-bounding method.

4. The LED chip package structure as claimed in claim 1, wherein the adhesive body is a heat-conducting adhesive body.

5. The LED chip package structure as claimed in claim 1, wherein each transparent body is made of transparent silicon.

6. The LED chip package structure as claimed in claim 1, wherein each transparent body is made of transparent epoxy.

7. The LED chip package structure as claimed in claim 1, wherein each frame layer is an opaque frame layer.

8. The LED chip package structure as claimed in claim 7, wherein each opaque frame layer is a white frame layer.