IMAGE SENSOR CHIP PACKAGE AND METHOD FOR FORMING THE SAME
First Claim
1. A method for forming an image sensor chip package, comprising:
- providing a substrate having a plurality of predetermined scribe lines defined thereon, wherein the predetermined scribe lines define a plurality of device regions in the substrate and each of the device regions has at least a device formed therein;
disposing a support substrate on a first surface of the substrate;
forming at least a spacer layer between the support substrate and the substrate, wherein the spacer layer covers the predetermined scribe lines;
forming a package layer on a second surface of the substrate;
forming a plurality of conducting structures on the second surface of the substrate, wherein the conducting structures are electrically connected to the corresponding device in corresponding one of the device regions, respectively; and
performing a dicing process including dicing the support substrate, the spacer layer, and the substrate along the predetermined scribe lines such that the support substrate is removed from the substrate and the substrate is separated into a plurality of individual image sensor chip packages.
1 Assignment
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Accused Products
Abstract
A method for forming an image sensor chip package includes: providing a substrate having predetermined scribe lines defined thereon, wherein the predetermined scribe lines define device regions and each of the device regions has at least a device formed therein; disposing a support substrate on a first surface of the substrate; forming at least a spacer layer between the support substrate and the substrate, wherein the spacer layer covers the predetermined scribe lines; forming a package layer on a second surface of the substrate; forming conducting structures on the second surface of the substrate, wherein the conducting structures are electrically connected to the corresponding device in corresponding one of the device regions, respectively; and dicing along the predetermined scribe lines such that the support substrate is removed from the substrate and the substrate is separated into a plurality of individual image sensor chip packages.
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Citations
18 Claims
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1. A method for forming an image sensor chip package, comprising:
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providing a substrate having a plurality of predetermined scribe lines defined thereon, wherein the predetermined scribe lines define a plurality of device regions in the substrate and each of the device regions has at least a device formed therein; disposing a support substrate on a first surface of the substrate; forming at least a spacer layer between the support substrate and the substrate, wherein the spacer layer covers the predetermined scribe lines; forming a package layer on a second surface of the substrate; forming a plurality of conducting structures on the second surface of the substrate, wherein the conducting structures are electrically connected to the corresponding device in corresponding one of the device regions, respectively; and performing a dicing process including dicing the support substrate, the spacer layer, and the substrate along the predetermined scribe lines such that the support substrate is removed from the substrate and the substrate is separated into a plurality of individual image sensor chip packages. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An image sensor chip package, comprising:
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an image sensor chip having an upper surface and a lower surface and having a light sensing device disposed at the upper surface; an optical element disposed on the light sensing device, wherein the optical element has a light receiving surface; a conducting layer extending from the lower surface towards the upper surface of the image sensor chip and electrically connected to the light sensing device; and a package layer formed on the lower surface of the image sensor chip and the conducting layer, wherein a shortest distance between the light receiving surface and a bottom surface of the package layer is not larger than about 130 μ
m. - View Dependent Claims (13, 14, 15, 16)
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17. An image sensor chip package, comprising:
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an image sensor chip having an upper surface and a lower surface and having a light sensing device disposed at the upper surface; an optical element disposed on the light sensing device, wherein the optical element has a light receiving surface; a conducting layer extending from the lower surface towards the upper surface of the image sensor chip and electrically connected to the light sensing device; and a package layer formed on the lower surface of the image sensor chip and the conducting layer, wherein no support substrate is disposed on the light receiving surface. - View Dependent Claims (18)
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Specification