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HEAT DISSIPATION FOR A CHIP PROTECTED BY AN ANTI-TAMPER BACKGROUND

  • US 20120050998A1
  • Filed: 11/03/2011
  • Published: 03/01/2012
  • Est. Priority Date: 11/03/2011
  • Status: Active Grant
First Claim
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1. An electronic device comprising:

  • a circuit board having electronics mounted thereon;

    a security shield covering one or more electronics on the circuit board and configured to sense tampering, the one or more electronics including a chip, the security shield defining an aperture; and

    a heat sink extending through the aperture and thermally coupling with the chip, the heat sink extending outside of the security shield.

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