IN-EAR HEADPHONE

• US 20120051574A1
• Filed: 08/31/2010
• Published: 03/01/2012
• Est. Priority Date: 08/31/2010
• Status: Abandoned Application

• Current Assignee: Cheng UEI Precision Industry Company Limited
• Original Assignee: Cheng UEI Precision Industry Company Limited
• Inventors: Lin, You-Ruei
• Application Number:
  US12/872,047
• Publication Number:
  US 20120051574A1
• Time in Patent Office: Days
• US Class Current: 381/353
• CPC Class Codes: H04R 1/1016 Earpieces of the intra-aural type
• CPC Class Codes: H04R 1/1058 Manufacture or assembly
• CPC Class Codes: H04R 1/2803 for loudspeaker transducers

Abstract

An in-ear headphone has a shell, a loudspeaker accommodated in a space of the shell for making sound, an ear cushion fixed on a supporting portion of the shell. A through channel passes the whole supporting portion for connecting the space with outside to transmit the sound produced by the loudspeaker. The ear cushion has a through hole passing through the whole ear cushion. A top of the through hole is enlarged to form a first receiving cavity for receiving a first damper. The first damper can seal against the outside region preventing the particles into the in-ear headphone and damaging the loudspeaker. Also, the first damper adjusts the sound effect of the in-ear headphone. Moreover, the first damper can be taken off the first receiving cavity easily and replaced by another one. So, the user can experience varies sound effect by changing the first damper.

Claims

1. An in-ear headphone, comprising:

a loudspeaker for making sound;

a shell having a space for accommodating the loudspeaker, a supporting portion protruded from a top of the shell, a through channel passing through the whole supporting portion for connecting the space with outside to transmit the sound produced by the loudspeaker; and

an ear cushion fixed on the supporting portion of the shell having a through hole passing through the whole ear cushion for accommodating the supporting portion, a top of the through hole enlarged to form a first receiving cavity for receiving a first damper.

2. The in-ear headphone as claimed in claim 1, wherein a top of the through channel is enlarged to form a second receiving cavity for receiving a second damper to adjust the sound.

3. The in-ear headphone as claimed in claim 1, wherein a middle portion of an outer surface of the supporting portion is recessed to form a circle recess, and correspondingly, a buckling portion is formed at an upper portion of the supporting portion, the buckling portion is mated with a buckling recess formed at a middle of the through hole for fixing the ear cushion on the supporting portion.