Microchip

• US 20120052240A1
• Filed: 03/05/2010
• Published: 03/01/2012
• Est. Priority Date: 05/15/2009
• Status: Active Grant

• Current Assignee: FUJIFILM Wako Pure Chemical Corporation (Fujifilm Holdings Corporation)
• Original Assignee: WAKO Pure Chemical Industries Limited (Fujifilm Holdings Corporation), Konica Minolta Inc.
• Inventors: Washizu, Takashi, Hirayama, Hiroshi
• Granted Patent: US 9,238,224 B2
• Time in Patent Office: Days
• US Class Current: 428/133
• CPC Class Codes: B01L 2200/027 for microfluidic devices
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2300/042 Caps; Plugs
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0877 Flow chambers
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: B29C 65/06 using friction, e.g. spin welding non-plastics elements to plastic elements B29C65/645
• CPC Class Codes: B29C 65/08 using ultrasonic vibrations non-plastics element to plastics elements B29C65/645
• CPC Class Codes: B29C 65/10 using hot gases (e.g. combustion gases) or flames coming in contact with at least one of the parts to be joined
• CPC Class Codes: B29C 65/16 Laser beams
• CPC Class Codes: B29C 65/18 using heated tools
• CPC Class Codes: B29C 65/20 with direct contact, e.g. using "mirror"
• CPC Class Codes: B29C 65/48 using adhesives , i.e. using supplementary joining material; solvent bonding
• CPC Class Codes: B29C 65/4895 Solvent bonding, i.e. the surfaces of the parts to be joined being treated with solvents, swelling or softening agents, without adhesives
• CPC Class Codes: B29C 66/112 Single lapped joints
• CPC Class Codes: B29C 66/131 Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
• CPC Class Codes: B29C 66/5346 said single elements being substantially flat
• CPC Class Codes: B29C 66/71 characterised by the composition of the plastics material of the parts to be joined welding bar compositions B29C65/125
• CPC Class Codes: B29C 66/7352 : Thickness, e.g. very thin
• CPC Class Codes: B29C 66/73921 : characterised by the materials of both parts being thermoplastics
• CPC Class Codes: B29K 2009/00 : Use of rubber derived from conjugated dienes, as moulding material
• CPC Class Codes: B29K 2023/06 : PE, i.e. polyethylene
• CPC Class Codes: B29K 2023/12 : PP, i.e. polypropylene
• CPC Class Codes: B29K 2023/38 : Polymers of cycloalkenes, e.g. norbornene or cyclopentene
• CPC Class Codes: B29K 2025/06 : PS, i.e. polystyrene
• CPC Class Codes: B29K 2027/06 : PVC, i.e. polyvinylchloride
• CPC Class Codes: B29K 2027/08 : PVDC, i.e. polyvinylidene chloride
• CPC Class Codes: B29K 2031/04 : Polymers of vinyl acetate, e.g. PVAc, i.e. polyvinyl acetate
• CPC Class Codes: B29K 2033/12 : Polymers of methacrylic acid esters, e.g. PMMA, i.e. polymethylmethacrylate
• CPC Class Codes: B29K 2033/20 : PAN, i.e. polyacrylonitrile
• CPC Class Codes: B29K 2067/003 : PET, i.e. poylethylene terephthalate
• CPC Class Codes: B29K 2069/00 : Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
• CPC Class Codes: B29K 2077/00 : Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
• CPC Class Codes: B29K 2083/00 : Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
• CPC Class Codes: B29L 2031/756 : Microarticles, nanoarticles
• CPC Class Codes: B32B 3/26 : characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids foam layer B32B5/18; layer of synthetic resin characterised by fillers that create voids or cavities B32B27/205; characterised by an apertured layer
• CPC Class Codes: B32B 3/263 : characterised by a layer having non-uniform thickness
• CPC Class Codes: B32B 3/266 : characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
• CPC Class Codes: B32B 3/30 : characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs apertured layer B32B3/266; layer with cavities or internal voids B32B3/26
• CPC Class Codes: B32B 7/04 : Interconnection of layers
• CPC Class Codes: Y10T 428/24289 : Embedded or interlocked

Abstract

A flow path groove is formed in the surface of at least one of two resin substrates; the two resin substrates are joined with the surface in which the flow path groove is formed facing inward; a through-hole having a substantially round cross section is formed in either one of the two resin substrates such that the through-hole connects with the flow path groove from the surface opposite the surface where the two resin substrates join; protruding parts, which protrude in the direction of thickness of the resin substrates and are disposed enclosing the through-hole, are formed in the surface on the opposite side; a space, which has a substantially round cross-sectional shape concentric with the through-hole and has depth in the same direction as the direction of thickness of the resin substrates, is formed in the joined surfaces when the protruding parts are projected from the direction substantially perpendicular to the joined surfaces; and the correlation of fc>fa is satisfied when the edges on the base end side of the through-hole are projected onto the joined surfaces from a substantially perpendicular direction, where the diameter on the base end side of the through-hole is fa and the diameter on the end edge side of the space touching the joined surfaces is fc

Claims

1. A microchip in which

a flow channel groove is formed in a surface of at least one of two resin substrates;

the two resin substrates are joined with a face facing inward where the flow channel groove is formed;

in at least either one of the two resin substrates, a through-hole of an almost circularly cross-sectional shape leading to the flow channel groove from a face of an opposite side to the face where the two resin substrates are joined is formed; and

in the face of the opposite side, a protrusion protruding in a thickness direction of the resin substrate provided so as to surround the through-hole is formed,

wherein the microchip in which a space having an almost circularly cross-sectional shape concentric with the through-hole and a depth in the same direction as the thickness direction of the resin substrate is formed on a joint face of one of the two resin substrates or the other resin substrate which is the joint face in the case where the protrusion is projected from an almost perpendicular direction to the joint face,

and when a base end side edge of the through-hole is projected on the joint face from the almost perpendicular direction, a relationship of φ

c>

φ

a is satisfied, provided that a diameter of the base end side of the through-hole is designated as φ

a and a diameter of an end edge side of the space making contact with the joint face is designated as φ

c.

2. The microchip of claim 1, satisfying a relationship of 2.5×

φ

b>

φ

c, provided that the diameter of the base end side of the protrusion in the case where the base end of the protrusion is projected on the joint face from the almost perpendicular direction is designated as φ

b.

3. The microchip of the claim 2, satisfying a relationship of φ

b≧

φ

c.

4. The microchip of claim 1,

the space is formed in the joint face of the resin substrates in which the flow channel groove has been formed in one of the two resin substrates

and the space has a depth so as for a clearance to remain between the base end side edge of the through-hole and the joint face even when the two resin substrates is joined.

5. The microchip of claim 4, satisfying the relationship of Ta≦

Tc≦

T/2,

provided that the depth of the space designated as Tc, the thickness of the resin substrate designated as T, and the depth of the flow channel groove are designated as Ta, respectively.

6. The microchip of claim 4,

wherein the space has a peripheral wall face slanting from the end edge side of the space toward the base end side edge of the through-hole.

7. The microchip of claim 4,

wherein the space has a peripheral wall face slanting from the end edge side of the space toward a tip side edge of the through-hole.