RFID TRANSPONDER AND A METHOD FOR FABRICATING THE SAME

• US 20120056002A1
• Filed: 05/08/2009
• Published: 03/08/2012
• Est. Priority Date: 05/08/2009
• Status: Active Grant

• Current Assignee: Confidex Incorporated
• Original Assignee: Confidex Incorporated
• Inventors: Ritamaki, Matti, Miettinen, Jarkko, Ruhanen, Antti
• Granted Patent: US 9,076,092 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole

Abstract

The present application provides a radio frequency identification (RFID) transponder and a method for fabricating the same. The RFID transponder, comprising: a microchip which is arranged to communicating with a reader; a battery which is arranged to provide an electrical power for operating the transponder, and is attached to the microchip by means of a conductive path; an antenna which is arranged to receive and backscatter radio frequency interrogation radiation; and a substrate, on which the microchip, the battery and the antenna are arranged.

Claims

1. A radio frequency identification (RFID) transponder, comprising:

a microchip which is arranged to communicating with a reader;

a battery which is arranged to provide an electrical power for operating the transponder, and is attached to the microchip by means of a conductive path;

an antenna which is arranged to receive and backscatter radio frequency interrogation radiation; and

a substrate, on which the microchip, the battery and the antenna are arranged.

2. The transponder of claim 1, wherein the battery is integrated as a part of the antenna.

3. The transponder of claim 2, wherein the battery acts as a ground plane for the antenna.

4. The transponder of claim 2, wherein the battery acts as a pole of the antenna when the antenna is a dipole antenna.

5. The transponder of claim 1, wherein the antenna is an inverted F antenna or a dipole antenna.

6. The transponder of claim 1, wherein the conductive path is a conductive wire, conductive glue or mechanical bond.

7. The transponder of claim 1, further comprising an encryption component, which is arranged to encode vehicle specific data with an encryption algorithm for preventing unauthorized use, cloning or counterfeiting of the RFID transponder.

8. The transponder of claim 1, further comprising a perforation area, which is arranged to weaken the tensile strength of the substrate, so that when an adhesive label is attempted to be removed the substrate will tear along the perforation.

9. The transponder of claim 1, wherein the microchip comprises:

both the analog part to modify the impedance matching of the antenna and the digital part which holds the logical functions and memory to enable the RFID functionalities according to the used air-interface standards.

10. The transponder of claim 1, wherein the substrate further comprising IC bonding area and contact area for battery.

11. The transponder of claim 1, wherein battery connection to the antenna or the microchip is done with mechanically crimping the layers to each other, by using conductive paste or film (ACP, ACF) or soldering.

12. The transponder of claim 1, wherein the transponder is primarily authenticated by utilizing the tag identification (TID) number which is unique for all microchips.

13. The transponder of claim 1, wherein the battery is attached to the antenna or the microchip by welding process.

14. The transponder of claim 13, wherein said welding process is an ultra-sonic welding process.

15. The transponder of claim 13, wherein said welding process is a heat welding process.

16. The transponder of claim 13, wherein said welding process uses non-conductive adhesive.

17. The transponder of claim 16, wherein said welding process uses pressure sensitive adhesive.

18. The transponder of claim 16, wherein said welding process uses hot melt adhesive.

19. The transponder of claim 13, wherein said battery is sealed by welding process.

20. The transponder of claim 13, wherein said transponder is sealed by welding process.

21. The transponder of claim 13, wherein RFID straps are attached to said antenna by welding process.

22. The transponder of claim 13, wherein galvanic connection is farmed between the battery and RFID tag circuitry in continuous reel-to-reel process by pressing the battery and RFID tag circuitry together and creating a defined pattern.

23. The transponder of claim 13, wherein galvanic connection is formed between the battery and RFID tag circuitry in stop-and-go, reel-to-reel process by pressing the battery and RED tag circuitry together and creating a defined pattern.

24. The transponder of claim 1, wherein the battery is a thin film battery.

25. The transponder of claim 1, wherein the battery is replaced by a thin photo voltaic cell.

26. The transponder of claim 25, wherein said transponder comprises a power reservoir.

27. The transponder of claim 26, wherein said power reservoir is attached to an antenna and microchip by using welding process.

28. The transponder of claim 27, wherein said welding process uses conductive adhesive.

29. The transponder of claim 27, wherein said welding process uses non-conductive adhesive.

30. The transponder of claim 26, wherein said power reservoir is attached to an antenna and microchip by using conductive adhesive materials.

31. The transponder of claim 26, wherein said power reservoir is in parallel with said photo voltaic cell.

32. The transponder of claim 26, wherein said power reservoir is in connected with said microchip directly.

33. The transponder of claim 26, wherein said power reservoir is a capacitor.

34. The transponder of claim 26, wherein said power reservoir is a battery.

35. The transponder of claim 1 wherein the battery is a beta decay source power cell.

36. The transponder of claim 35, wherein the beta decay source power cell is a tritium power cell.

39. The method of claim 1, wherein the battery is attached to the antenna and the microchip by welding process.

40. The method of claim 39, wherein said welding process is an ultra-sonic welding process.

41. The method of claim 39, wherein said welding process is a heat welding process.

42. The method of claim 39, wherein said welding process uses non-conductive adhesive.

43. The method of claim 42, wherein said welding process uses pressure sensitive adhesive.

44. The method of claim 42, wherein said welding process uses hot melt adhesive.

45. The method of claim 39, wherein said battery is sealed by welding process.

46. The method of claim 39, wherein said transponder is sealed by welding process.

47. The method of claim 39, wherein RFID straps are attached to said antenna by welding process.

48. The transponder of claim 39, wherein galvanic connection is formed between the battery and RFID tag circuitry comprising at least antenna and microchip in continuous reel-to-reel process by pressing the battery and the RFID tag circuitry together and creating a defined pattern.

49. The transponder of claim 39, wherein galvanic connection is formed between the battery and RFID tag circuitry in stop-and-go, reel-to-reel process by pressing the battery and RFID tag circuitry together and creating a defined pattern.

50. The transponder of claim 1, wherein the transponder identification number contains meaningful data and data is encrypted with cryptographic measures to prevent counterfeiting.

37. A method for fabricating a radio frequency identification (RFID) transponder, comprising:

preparing a substrate;

arranging a microchip, a battery and an antenna on the substrate, wherein the microchip is arranged to communicating with a reader, the battery is arranged to provide electrical power for operating the transponder, and is attached to the microchip by means of a conductive path, and the antenna is arranged to receive and backscatter radio frequency interrogation radiation.

38. The method of claim 37, wherein battery connection to the antenna or microchip is done with mechanically crimping the layers to each other, by using conductive paste or film (ACP, ACF) or soldering.