MEMS Sensor Package

• US 20120056280A1
• Filed: 10/22/2010
• Published: 03/08/2012
• Est. Priority Date: 09/03/2010
• Status: Abandoned Application

• Current Assignee: Domintech Co., Ltd.
• Original Assignee: Domintech Co., Ltd.
• Inventors: WU, Ming-Ching, Huang, Chih-Kung
• Application Number:
  US12/910,394
• Publication Number:
  US 20120056280A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: B81C 2203/032 Gluing
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0842 the mass being of clover leaf shape
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73257 Bump and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A MEMS sensor package includes a support and a MEMS sensor chip having a mounting side adhered on the support by a point-shaped adhesive or a linear-shaped adhesive in such a way that the MEMS sensor chip has a free side opposite to the mounting and suspended above the support. Because the MEMS sensor chip has the free side that is not restrained on the support, the stress due to deformation of the support will not affect the accuracy of the MEMS sensor chip.

Claims

1. A MEMS sensor package, comprising:

a support; and

a MEMS sensor chip adhered on the support and having a free side suspended above the support.

2. The MEMS sensor package as claimed in claim 1, wherein the MEMS sensor chip has a mounting side opposite to the free side and adhered on the support by at least one point-shaped adhesive.

3. The MEMS sensor package as claimed in claim 2, wherein the mounting side of the MEMS sensor chip has two corners, each of which is adhered on the support by one said point-shaped adhesive.

4. The MEMS sensor package as claimed in claim 3, further comprising:

an ASIC chip bonded on the MEMS sensor chip in a way that the free side of the MEMS sensor chip is suspended between the support and the ASIC chip; and

a spacer supported between the support and the ASIC chip.

5. The MEMS sensor package as claimed in claim 3, wherein the support is an ASIC chip having a bottom side bonded on a printed circuit board.

6. The MEMS sensor package as claimed in claim 1, wherein the MEMS sensor chip has a mounting side opposite to the free side and adhered on the support by a linear-shaped adhesive.

7. The MEMS sensor package as claimed in claim 6, further comprising:

an ASIC chip bonded on the MEMS sensor chip in a way that the free side of the MEMS sensor chip is suspended between the support and the ASIC chip; and

a spacer supported between the support and the ASIC chip.

8. The MEMS sensor package as claimed in claim 6, wherein the support is an ASIC chip having a bottom side bonded on a printed circuit board.

9. The MEMS sensor package as claimed in claim 1, wherein the MEMS sensor chip comprises a frame having the free side, a plurality of flexible bridges extending from the frame towards a center of the frame, and a moveable sensing element connected with the flexible bridges such that the moveable sensing element is suspended inside the frame.

10. The MEMS sensor package as claimed in claim 9, wherein the frame of the MEMS sensor chip has a mounting side opposite to the free side and adhered on the support by at least one point-shaped adhesive.

11. The MEMS sensor package as claimed in claim 10, wherein the mounting side of the frame of the MEMS sensor chip has two corners, each of which is adhered on the support by one said point-shaped adhesive.

12. The MEMS sensor package as claimed in claim 11, further comprising:

an ASIC chip bonded on the MEMS sensor chip in a way that the free side of the MEMS sensor chip is suspended between the support and the ASIC chip; and

a spacer supported between the support and the ASIC chip.

13. The MEMS sensor package as claimed in claim 11, wherein the support is an ASIC chip having a bottom side bonded on a printed circuit board.

14. The MEMS sensor package as claimed in claim 9, wherein the frame of the MEMS sensor chip has a mounting side opposite to the free side and adhered on the support by a linear-shaped adhesive.

15. The MEMS sensor package as claimed in claim 14, further comprising:

an ASIC chip bonded on the MEMS sensor chip in a way that the free side of the MEMS sensor chip is suspended between the support and the ASIC chip; and

a spacer supported between the support and the ASIC chip.

16. The MEMS sensor package as claimed in claim 14, wherein the support is an ASIC chip having a bottom side bonded on a printed circuit board.

17. The MEMS sensor package as claimed in claim 1, wherein the support is a printed circuit board.

18. The MEMS sensor package as claimed in claim 17, further comprising:

an ASIC chip bonded on the MEMS sensor chip in a way that the free side of the MEMS sensor chip is suspended between the printed circuit board and the ASIC chip; and

a spacer supported between the printed circuit board and the ASIC chip.

19. The MEMS sensor package as claimed in claim 1, wherein the support is an ASIC chip having a bottom side bonded on a printed circuit board.