SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

• US 20120058599A1
• Filed: 09/08/2011
• Published: 03/08/2012
• Est. Priority Date: 08/08/2008
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: YAMAZAKI, Shunpei, MIYAIRI, Hidekazu, AKIMOTO, Kengo, SHIRAISHI, Kojiro
• Granted Patent: US 8,481,363 B2
• Time in Patent Office: Days
• US Class Current: 438/104
• CPC Class Codes: H01L 27/1225 with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

The semiconductor device includes a thin film transistor which includes a gate electrode layer, a gate insulating layer over the gate electrode layer, a source electrode layer and a drain electrode layer over the gate insulating layer, a buffer layer over the source electrode layer and the drain electrode layer, and a semiconductor layer over the buffer layer. A part of the semiconductor layer overlapping with the gate electrode layer is over and in contact with the gate insulating layer and is provided between the source electrode layer and the drain electrode layer. The semiconductor layer is an oxide semiconductor layer containing indium, gallium, and zinc. The buffer layer contains a metal oxide having n-type conductivity. The semiconductor layer and the source and drain electrode layers are electrically connected to each other through the buffer layer.

Claims

1. A method for manufacturing a semiconductor device comprising:

forming a first conductive layer over a substrate;

forming an insulating layer over the first conductive layer;

forming a second conductive layer and a third conductive layer over the insulating layer;

forming a first layer over the second conductive layer and a second layer over the third conductive layer; and

forming a semiconductor layer over the first layer and the second layer,

wherein the semiconductor layer includes indium and oxygen,

wherein each of the first layer and the second layer includes a metal oxide having n-type conductivity, and

wherein each of the first layer and the second layer has a higher carrier concentration than the semiconductor layer.

2. The method for manufacturing a semiconductor device according to claim 1,

wherein a part of the semiconductor layer overlapping with the first conductive layer is over and in contact with the insulating layer and is provided between the second conductive layer and the third conductive layer.

3. The method for manufacturing a semiconductor device according to claim 1,

wherein the second conductive layer and the third conductive layer includes titanium.

4. The method for manufacturing a semiconductor device according to claim 1,

wherein each of the first layer and the second layer includes an impurity element imparting n-type conductivity, and

wherein the impurity element is selected from the group consisting of indium, gallium, aluminum, tin, and zinc.

5. The method for manufacturing a semiconductor device according to claim 1,

wherein the metal oxide in the first layer and the second layer is selected from the group consisting of titanium oxide, molybdenum oxide, zinc oxide, indium oxide, tungsten oxide, magnesium oxide, calcium oxide, or tin oxide.

6. The method for manufacturing a semiconductor device according to claim 1, wherein the semiconductor layer is formed by a sputtering method.

7. The method for manufacturing a semiconductor device according to claim 6, wherein the sputtering method is performed under an oxygen atmosphere or an atmosphere containing oxygen at 90% or higher and a rare gas at 10% or lower.

8. The method for manufacturing a semiconductor device according to claim 1, wherein the second conductive layer and the third conductive layer are formed by a screen printing method of an ink jet method.

9. A method for manufacturing a semiconductor device comprising:

forming a first conductive layer over a substrate;

forming an insulating layer over the first conductive layer;

forming a second conductive layer and a third conductive layer over the insulating layer by a screen printing method of an ink jet method; and

forming a semiconductor layer over the second conductive layer and the third conductive layer,

wherein the semiconductor layer includes indium and oxygen.

10. The method for manufacturing a semiconductor device according to claim 9,

wherein a part of the semiconductor layer overlapping with the first conductive layer is over and in contact with the insulating layer and is provided between the second conductive layer and the third conductive layer.

11. The method for manufacturing a semiconductor device according to claim 9,

wherein the second conductive layer and the third conductive layer includes titanium.

12. The method for manufacturing a semiconductor device according to claim 9, wherein the semiconductor layer is formed by a sputtering method.

13. The method for manufacturing a semiconductor device according to claim 12, wherein the sputtering method is performed under an oxygen atmosphere or an atmosphere containing oxygen at 90% or higher and a rare gas at 10% or lower.

14. A method for manufacturing a semiconductor device comprising:

forming a first conductive layer over a substrate;

forming an insulating layer over the first conductive layer;

forming a second conductive layer and a third conductive layer over the insulating layer;

forming a first layer over the second conductive layer and a second layer over the third conductive layer;

forming a third layer over the first layer and a fourth layer over the second layer; and

forming a semiconductor layer over the first layer and the second layer,

wherein the semiconductor layer includes indium and oxygen,

wherein each of the first layer and the second layer includes a metal oxide having n-type conductivity, and

wherein each of the first layer and the second layer has a higher carrier concentration than the semiconductor layer.

15. The method for manufacturing a semiconductor device according to claim 14,

wherein a part of the semiconductor layer overlapping with the first conductive layer is over and in contact with the insulating layer and is provided between the second conductive layer and the third conductive layer.

16. The method for manufacturing a semiconductor device according to claim 14,

wherein the second conductive layer and the third conductive layer includes titanium.

17. The method for manufacturing a semiconductor device according to claim 14,

wherein each of the first layer and the second layer includes an impurity element imparting n-type conductivity, and

wherein the impurity element is selected from the group consisting of indium, gallium, aluminum, tin, and zinc.

18. The method for manufacturing a semiconductor device according to claim 14,

wherein the metal oxide in the first layer and the second layer is selected from the group consisting of titanium oxide, molybdenum oxide, zinc oxide, indium oxide, tungsten oxide, magnesium oxide, calcium oxide, or tin oxide.

19. The method for manufacturing a semiconductor device according to claim 14, wherein the semiconductor layer is formed by a sputtering method.

20. The method for manufacturing a semiconductor device according to claim 19, wherein the sputtering method is performed under an oxygen atmosphere or an atmosphere containing oxygen at 90% or higher and a rare gas at 10% or lower.

21. The method for manufacturing a semiconductor device according to claim 14, wherein the second conductive layer and the third conductive layer are formed by a screen printing method of an ink jet method.