DISTRIBUTED COOLING OF ARRAYED SEMI-CONDUCTOR RADIATION EMITTING DEVICES
First Claim
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1. A system for providing cooling to an array of semi-conductor based radiation emitting devices, the system comprising:
- a mounting substrate to which the array of radiation emitting devices is mounted on a first surface thereof, the mounting substrate including at least one of a first material having high thermal conductivity and a second material having electrical insulating features;
a heat exchange body connected to a second surface of the mounting substrate;
heat exchange fluid cavity within the heat exchange body operative to maintain a flow of heat exchange fluid in the heat exchange body; and
,fluid connections provided to an inlet and an outlet of the heat exchange fluid cavity.
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Abstract
Techniques for the removal of waste heat from solid state, semiconductor devices (such as cooking or heating devices) are provided. In particular, techniques for conducting waste heat away from the device through a heat sink in contact with a cooling system are provided. In addition, a multi-head cooling system applicable to multiple solid state, semiconductor sources is provided.
28 Citations
25 Claims
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1. A system for providing cooling to an array of semi-conductor based radiation emitting devices, the system comprising:
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a mounting substrate to which the array of radiation emitting devices is mounted on a first surface thereof, the mounting substrate including at least one of a first material having high thermal conductivity and a second material having electrical insulating features; a heat exchange body connected to a second surface of the mounting substrate; heat exchange fluid cavity within the heat exchange body operative to maintain a flow of heat exchange fluid in the heat exchange body; and
,fluid connections provided to an inlet and an outlet of the heat exchange fluid cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A system for providing cooling to multiple arrays of semi-conductor based radiation emitting devices, the system comprising:
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a first array cooling subassembly including a first mounting substrate to which a first array of radiation emitting devices is mounted on a first surface thereof, the mounting substrate including at least one of a first material having high thermal conductivity and a second material having electrical insulating features, a first heat exchange body connected to a second surface of the mounting substrate, a first heat exchange fluid cavity within the first heat exchange body operative to maintain a flow of heat exchange fluid in the first heat exchange body, and first fluid connections provided to an inlet and an outlet of the first heat exchange fluid cavity; and
,a second array cooling subassembly including a second mounting substrate to which a second array of radiation emitting devices is mounted on a first surface thereof, a second heat exchange body connected to a second surface of the mounting substrate, a second heat exchange fluid cavity within the second heat exchange body operative to maintain a flow of heat exchange fluid in the second heat exchange body, and second fluid connections provided to an inlet and an outlet of the second heat exchange fluid cavity. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A method for providing cooling to an array of semi-conductor based radiation emitting devices disposed on an array cooling subassembly including a mounting substrate to which the array of radiation emitting devices is mounted on a first surface thereof, the mounting substrate including at least one of a first material having high thermal conductivity and a second material having electrical insulating features, a heat exchange body connected to a second surface of the mounting substrate, a heat exchange fluid cavity within the heat exchange body operative to maintain a flow of heat exchange fluid in the heat exchange body, fluid connections provided to an inlet and an outlet of the heat exchange fluid cavity, the method comprising:
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receiving data at a controller; determining fluid flow parameters for the flow of heat exchange fluid in the heat exchange cavity based on the data; and
,controlling the flow to the inlet of the heat exchange cavity based on the determined fluid flow parameters.
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Specification